NXP Advances 5G with New Gallium Nitride Fab in Arizona
September 29, 2020 | Globe NewswireEstimated reading time: 3 minutes
NXP Semiconductors N.V. announced the grand opening of its 150 mm (6-inch) RF Gallium Nitride (GaN) fab in Chandler, Arizona, the most advanced fab dedicated to 5G RF power amplifiers in the United States. The new internal factory combines NXP’s expertise as the industry leader in RF power and its high-volume manufacturing know-how, resulting in streamlined innovation that supports the expansion of 5G base stations and advanced communication infrastructure in the industrial, aerospace and defense markets.
The opening ceremony was marked by keynote addresses and remarks by NXP executives plus federal, state and local government officials, including:
- Arizona Senators Kyrsten Sinema and Martha McSally
- U.S. Representative Greg Stanton
- Arizona Governor Doug Ducey
- City of Chandler Mayor Kevin Hartke
- U.S. Department of Commerce Deputy Under Secretary for International Trade Joseph Semsar
- Ambassador of the Kingdom of the Netherlands to the United States Andre Haspels
In his keynote address, Kurt Sievers, NXP CEO said: “Today marks a critical milestone for NXP. By building this incredible facility and tapping key talent in Arizona, we are able to bring focus to GaN technology as part of driving the next generation of 5G base station infrastructure.”
Gallium Nitride: The new gold standard for 5G
With 5G, the density of RF solutions required per antenna has exponentially increased – yet maintaining the same box size and reducing power consumption is mandatory. GaN power transistors have emerged as the new gold standard to address these dueling requirements, delivering significant improvements in both power density and efficiency.
Nearly 20 years of GaN development expertise and extensive wireless communication industry knowledge uniquely position NXP to lead this next wave of cellular expansion for 5G. The company has deeply optimized its GaN technology to improve the electron trapping in the semiconductor to deliver high efficiency and gain with best-in-class linearity, all of which is focused on serving NXP customers with the highest quality GaN device production.
Joakim Sorelius, Head of Development Unit Networks at Ericsson, a longstanding NXP customer, commented: “We strive to deliver industry leading products that provide maximum value to our customers, where power amplifiers play an important part of the radio technology. Similar to Ericsson’s recent US investments, we are pleased to see NXP's investments in the U.S. semiconductor process development with the continuous focus on improving RF system performance for future high demanding radio networks."
State-of-the-art fab draws on NXP’s early GaN innovation and total quality mindset
NXP’s strategic move to build an internal GaN fab was driven by its ability to achieve higher performance benefits through leveraging its core competency in cellular infrastructure design, proven track record for high-volume manufacturing and consistency and leadership in total quality processes.
“I am excited by the opening of our new facility in Chandler as it underscores NXP’s decades-long commitment to GaN and the communications infrastructure market,” said Paul Hart, Executive Vice President and GM of the Radio Power Group at NXP. “I would like to thank our customers for their collaboration throughout the years and the entire NXP team that has been instrumental in creating the world’s most advanced RF GaN fab, which is designed and ready to scale to 6G and beyond.”
The fab is set to ramp quickly with NXP leveraging its Chandler-based team and their long-standing expertise in compound semiconductor manufacturing. Arizona Governor Doug Ducey added: “With this new state-of-the-art manufacturing facility in Chandler, Arizona is set to expand its reputation as a high-tech manufacturing hub and a pioneer in 5G innovation. We’re grateful to NXP for bringing more jobs and investment to our state.”
The internal factory will serve as an innovation hub that facilitates collaboration between the fab and NXP’s onsite R&D team. NXP engineers can now more rapidly develop, validate and protect inventions for current and future generations of GaN devices, resulting in shorter cycle times for NXP GaN innovations.
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Nortech Positioned to Serve Global Markets Amid Tariff Challenges
04/18/2025 | BUSINESS WIRENortech Systems, a global leader in digital connectivity solutions and data management engineering, is strategically positioned to serve customers in Europe and the Asia Pacific region while effectively mitigating the impact of global tariffs and trade challenges.
Can the Electronics Industry Balance Tariffs With Investment?
04/18/2025 | I-Connect007 Editorial TeamTo better understand the U.S. administration’s recent actions on global trade policies, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.
University of Arizona Pioneering Technical Education Beyond Semiconductors
04/18/2025 | Marcy LaRont, PCB007 MagazineWhile many universities struggle to keep their curriculum up to date with the evolving needs of the electronics industry, the University of Arizona stands head and shoulders above the others. Its Center for Semiconductor Manufacturing incorporates five of the colleges at UA and emphasizes an interdisciplinary approach to prepare students for diverse careers in technology and manufacturing.
IPC President’s Award: Xaver Feiner
04/17/2025 | Nolan Johnson, SMT007 MagazineThroughout his career, Xaver Feiner, vice president of marketing and sales at Zollner Elektronik, has developed extensive expertise in account management and new business development with a strong focus on the semiconductor industry, aerospace, and industrial electronics. Xaver has cultivated a profound understanding of global markets and remains deeply engaged with the challenges and opportunities presented by digital transformation. Since 2020, he has been an active member of the IPC Europe Advocacy Group, where he is dedicated to advancing the position of the electronics industry and the EMS sector across Europe.