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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Infineon, LS ELECTRIC Team Up on DC Power Solutions for AI Data Centers

07/16/2026 | Infineon
Infineon Technologies AG and LS ELECTRIC have signed a Memorandum of Understanding (MoU) to collaborate on high-efficiency direct current (DC) power infrastructure solutions for AI data centers and next-generation power grids.

Gartner Identifies the Companies to Beat in the AI Semiconductor Vendor Race

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New York Imposes One-Year Moratorium on New AI Data Centers

07/15/2026 | I-Connect007 Editorial Team
New York has become the first U.S. state to impose a temporary statewide moratorium on new hyperscale data centers, following an executive order signed July 14 by Gov. Kathy Hochul. 

Delta Electronics (Americas) and X LABS Sign Technology Partnership MOU to Power Next-Gen AI Data Centers

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Delta Electronics announced a Memorandum of Understanding (MOU) with X LABS, an investment manager and developer of islanded grids, to deliver energy-as-a-service (EaaS) to AI data center projects.

3 Key Takeaways: A New Approach to Die Topside Interconnection

07/15/2026 | I-Connect007
Every advance in power electronics places new demands on semiconductor packaging. As manufacturers push for greater power density, improved thermal management, and smaller form factors, even long-established interconnection methods deserve a fresh look. In its latest white paper, MacDermid Alpha Electronics Solutions examines how a sinter-ready copper foil solution could simplify die topside interconnection while improving performance.
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