Arteris IP to Acquire Assets of Magillem Design Services
October 1, 2020 | PRWEBEstimated reading time: 2 minutes
Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, announced a definitive agreement with Magillem Design Services under which Arteris IP will acquire the assets of Magillem Design Services. Substantially all Magillem team members will be joining Arteris IP.
The combination of global technology leaders brings together Arteris IP’s state-of-the-art network-on-chip (NoC) interconnect IP with Magillem’s leading chip design and assembly environment, creating the premier semiconductor IP and software tools company for the age of artificial intelligence (AI) and machine learning (ML). The company will accelerate the pace of innovation and the ease-of-design for the complex systems-on-chip (SoC) that power this computing revolution, which is transforming automotive, machine learning and 5G wireless communications markets.
As part of Arteris IP, Magillem’s software products will continue to be offered separately from the Arteris interconnect IP offerings and the joined company will continue to execute on Magillem’s existing product and technology roadmaps. Both Arteris IP’s and Magillem’s existing worldwide SoC design team customers will benefit not only from the increased engineering and global support resources of the combined company, but also from the technology integration between the two companies’ product lines that will occur over time. The combined entity will be the leader in SoC assembly solutions to improve how SoCs are designed today and in the future.
“The combination of Arteris IP and Magillem will provide unparalleled global support and technology advancements for existing Arteris IP and Magillem licensees,” said Isabelle Geday, founder and CEO of Magillem Design Systems. “In addition to sharing many mutual customers worldwide, Arteris IP and Magillem share a common customer-centric ethos focused on helping our users accelerate chip development with world class SoC development software and IP. Our team is excited to join Arteris IP in pursuing this common vision.”
“Arteris IP and Magillem share a passion for helping our customers create the world’s most sophisticated systems-on-chip with state-of-the-art technology that shortens design schedules and increases profit margins, so we are delighted to welcome the Magillem team into Arteris IP,” said K. Charles Janac, President and CEO of Arteris IP. “As we integrate our technologies to accelerate and simplify the SoC assembly design flow, we will enhance innovation in both SoC IP integration software and the highly configurable on-chip interconnect IP that implements chip architectures.”
The proposed transaction is subject to customary closing conditions and is expected to take place during the fourth quarter of 2020.
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).