SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
Standard of Excellence: Training Your Team to Excel in Customer Service
Smart Automation: What Industry 4.0 Means for Mid-sized Electronics Manufacturing
Neways Announces COO Departure
October 7, 2020 | Neways Electronics International N.V.Estimated reading time: 1 minute
Neways Electronics International N.V. announces that by mutual agreement Adrie van Bragt (54), Chief Operating Officer (COO) will be leaving the company as per 31 December 2020. The Supervisory Board has started the recruitment process to find his successor.
Adrie van Bragt, COO: “I have had the privilege of working at Neways for 28 years, with the last six as a member of the Board of Directors. For me this is the right moment to close this period, transfer my responsibilities and to pursue new challenges. I am proud of how Neways has developed over the past three decades and of the fact that I was able to make a contribution to that development. Although I will remain in function until the end of the year, I would like to take this opportunity to thank all my colleagues for the excellent cooperation over the past years. I am firmly convinced that Neways has a wonderful future ahead of it.”
Henk Scheepers, chairman of the Supervisory Board: “The Supervisory Board is grateful to Adrie for his years of commitment and dedication. As the COO, he has made a significant contribution to the growth of the company and the professionalisation of the internal organisation. Partly thanks to his efforts, Neways is now ready for the next phase in its development as an EMS life cycle partner and system integrator.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Solving the Toughest BGA Challenges in Electronics
07/30/2025 | Nash Bell, BEST Inc.Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.
Reciprocal Tariffs and Talent Bottlenecks are Driving Changes in PCB Investment in Southeast Asia
07/30/2025 | TPCAAs the global supply chain continues to restructure, Southeast Asia, leveraging its geographical advantages and favorable policies, has become a strategic hub for global circuit board manufacturing.
Target Condition: The 5 Ws of PCB Design Constraints
07/29/2025 | Kelly Dack -- Column: Target ConditionHave you ever sat down to define PCB design constraints and found yourself staring at a settings window with more checkboxes than a tax form? You’re not alone. For many designers—especially those newer to the layout world—the task of setting up design constraints can feel like trying to write a novel in a language you just started learning.
From Attraction to Action: Where Marketing Ends and Sales Begins
07/29/2025 | Brittany Martin, I-Connect007Before a PO hits the system, marketing has already done a lot of heavy lifting. Without strategic marketing, the PO might never arrive. At I-Connect007, we have been fortunate to help many companies achieve sales success through marketing. The key to success? Understanding how marketing leads to sales.
Calumet Electronics Continues to Advance Domestic HDI Circuit Board and Organic Substrate Capability
07/25/2025 | Calumet ElectronicsCalumet Electronics Corporation, a leading American-made printed circuit board (PCB) manufacturer, today announces another major milestone in its ambitious program to bring advanced high-density interconnect (HDI) and high-density buildup (HDBU) capabilities online.