-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Graphene Flagship Launches First European Experimental Pilot Line
October 8, 2020 | Graphene FlagshipEstimated reading time: 3 minutes
The Graphene Flagship, upon the invitation of the European Commission, is creating an experimental pilot line for graphene-based electronics, optoelectronics and sensors – a first-of-its-kind experimental manufacturing facility, where European companies, research centres and academic institutions, can produce novel devices based on two-dimensional (2D) materials on a pilot scale. The online kickoff meeting was scheduled for Oct. 8.
The goal of this ambitious undertaking is to demonstrate how to manufacture and scale up the production of devices based on 2D materials for market applications. This is a crucial step before graphene technologies can be transferred to full scale manufacturing.
The Graphene Flagship has proposed a consortium consisting of key European players covering the whole value chain, including tool manufacturers, chemical and material providers and semiconductor fabrication lines: Aixtron and Oxford Instruments (UK), imec (Belgium), AMO, iHP, Micro Resist Technology, Aixtron and Suss Microtech (Germany), Graphenea (Spain) and VTT (Finland).
"For many applications, the wafer scale integration of graphene and potentially other 2D materials is required for products to appear on the market," says Lilei Ye, Business Developer for Electronics Applications at the Graphene Flagship. "The 2D Experimental Pilot Line (2D-EPL) will accelerate the manufacture of new prototypes for electronics, photonics and optoelectronics with integrated graphene and layered materials."
"Two-dimensional materials have unique properties for electronic and photonic devices, as well as for sensors," says Cedric Huyghebaert, technical leader of the 2D-EPL project and programme manager for exploratory material and module integration at imec. "There are now plenty of prototypes of devices based on 2D materials that out-perform current technologies. To bring these devices into the market we need to develop tool kits and design manuals to allow manufacturing compatible with semiconductor industry standards."
"The 2D-EPL really highlights how the European Commission, through projects like the Graphene Flagship, can make an impact in European research, development and industry," says Graphene Flagship Director Jari Kinaret. "We identified a challenge – upscaling the production of graphene electronics – and the European Commission heard us, finding funding to address this challenge."
The 2D-EPL will enable the prototyping of new devices for electronic, photonic and sensor applications in a manufacturing-representative environment. The timeline is ambitious: The pilot-line workflows and protocols should be fully functioning by 2024. The process flow will be validated in state-of-the-art cleanroom environments all around Europe, at AMO, iHP, imec and VTT.
To help establish a European ecosystem for 2D materials covering the entire value chain, the 2D-EPL will be open to the whole community, exploiting a shared-costs model between users and service providers. The objective is to become a sustainable, on-demand service for researchers and innovators in Europe and beyond, integrated into the EUROPRACTICE framework.
The 2D-EPL project can count on the expertise of the Graphene Flagship team at Chalmers University of Technology (Sweden) for the administrative, business development and dissemination support. The technical and scientific management is led by imec and supported by a core technical steering-group consisting of principle investigators from the integration sites of the pilot line. Furthermore, the project is guided by an Industrial Advisory Board, which comprises key players from the European semiconductor industry, such as X-FAB, Infineon and Emberion. The Board will be kept informed about the progress and the solutions developed by the 2D-EPL project and will also provide feedback on industry requirements and specifications, market analyses and early opportunities for the project.
The Pilot Line builds on the existing activities of its partners in the Graphene Flagship and it is closely intertwined with the Graphene Core 3 project. However, its activities are complementary to those developed in other parts of the Flagship and involve new players. The focus and organization of the new 2D-EPL project are different from that of the Flagship, and closely related to other existing European pilot lines.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.