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Indium Corporation Expert to Present at EPP InnovationsFORUM Germany
October 14, 2020 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria, and Switzerland, will present at the virtual EPP InnovationsFORUM Germany on Oct. 28 at 12:05 p.m. Central European Time.
Markets for electronic devices and assemblies are rapidly changing due to ever-shorter development times in the industrial and automotive sectors. In his presentation Future Solutions for Individual Electronics Production in Germany, Karch examines how new high-performance applications, such as “multicopters” and semi-autonomous vehicles, are driving demands for new high-reliability solder alloys.
Karch shares process knowledge with and makes technical recommendations for the use of Indium Corporation’s materials to customers in Germany, Austria, and Switzerland, including solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of automotive industry experience in PCB and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Karch is an ECQA-certified integrated design engineer and holds a Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to its customers in Europe.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com
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05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.