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Atotech to Present at the 17th International Wafer-Level Packaging Conference 2020
October 19, 2020 | AtotechEstimated reading time: 1 minute
Atotech, a global leader in the field of specialty chemicals and equipment for printed circuit board, package substrate, and semiconductor manufacturing will participate in the upcoming IMPACT-EMAP 2020 Conference, which will be held in conjunction with TPCA Show 2020. The conference will be held from October 21 – 23, 2020 at the Taipei Nangang Exhibition Center.
This year, Atotech’s experts will participate in the following sessions:
Visitors of the conference are very welcome to attend Atotech’s presentations and also to visit the company’s booth N0613 at TPCA Show to talk directly to local and international experts to learn about the latest trends, products and equipment Atotech offers to the industry.
For more information about Atotech or its product offering, please visit www.atotech.com.
About Atotech:
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computing; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support – making Atotech a critical partner to over 8,000 customers worldwide.
Atotech, headquartered in Berlin, Germany, is a team of 4,000 experts in over 40 countries generating annual revenues of $1.2 billion (2019). Atotech has manufacturing operations across Europe, the Americas, and Asia.
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