-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Just Ask Greg: Advice on Purchasing SMT Stencils
October 21, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, and John Mitchell in our “Just Ask” series. Now, Greg Smith, an SMT007 columnist, gets a chance to answer a question.
Greg Smith has worked in the electronics industry since 1989. He was the owner and president of a stencil manufacturing company for 23 years before joining Fineline Stencil. After the merger of Fineline Stencil and MET, he became the manager of stencil technology for BlueRing Stencils. Greg writes and presents white papers, works with customers on stencil design, and performs root-cause analyses to improve customer yields.
We hope you enjoy “Just Ask Greg.”
Q: Should we buy just the foil, or do you think that it’s better to buy and keep them on the same frame for repeat orders?
A: There are several options when purchasing SMT stencils. The first option is framed stencils, where a polyester mesh is mounted to an aluminum frame, and the stencil foil is then mounted to the polyester mesh. The mesh is then removed within the stencil foil, leaving a very uniform tension on the foil from all four sides. This is historically the best method for using SMT stencils. When the stencil is needed, it can be placed directly into the printer, used, cleaned, and then placed back in storage.
With this traditional framed stencil, there are no worries about tensioning bladders that can leak during the mounting or de-mounting process or springs that can become week over time. However, some of these frames require more storage space than the non-traditional “frameless” systems available.
The second type of frame option is foils with tensioning systems around the sides of the foils, such as DEK VectorGuard™, Apshen, and QTS systems. These fit into “master frames,” and tension is applied to the foils before printing. These are good options when stencil storage is at a premium while still providing even tension on the stencil foil during the print process. It is not recommended to order stencils that are not tensioned in some way during the print process.
Suggested Items
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.