-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Yamaha Supports 3D MID Learning at Friedrich Alexander University
October 27, 2020 | Yamaha Motor Europe Robotics, SMT SectionEstimated reading time: 2 minutes
Yamaha Motor Europe Robotics, SMT Section is supporting the Institute for Factory Automation and Production Systems (FAPS) at Friedrich Alexander University in Nuremberg, Germany, to enhance the study of cutting-edge 3D MID technology.
By providing FAPS with the Yamaha S20 modular 3D dispensing & mounting machine, Yamaha has enabled the faculty to use the Yamaha S20 machine with the unique robot manipulator to build 3D MID products by dispensing glue and/or solder paste and mounting electronic components in one production step. Yamaha is also providing technical support and expertise, leveraging the skills of its experienced field engineers, to help maintain the machine and assist learning and research.
The collaboration with FAPS builds on Yamaha’s membership of the German Forschungsvereinigung 3D MID e.V, announced in April 2020, to further strengthen the Company’s commitment to 3D MID technology. By allowing circuit structuring and component placement directly on a moulded substrate, such as the device enclosure, 3D MID enables complex, high-tech products to be produced simply and economically, as well as being small and lightweight. It is an ideal technology for advanced consumer devices, automotive electronics, and IoT endpoints such as smart sensors and actuators.
“Yamaha’s commitment enhances the quality of the education we can provide for our students and empowers our researchers to tackle exciting new challenges. We can do so much more now that we have a complete automated 3D MID line, and the technical backup from the Yamaha team gives us extra confidence to reach further and discover the full extent of this technology’s capabilities,” said Head of Institute for Factory Automation and Production Systems (FAPS) Institute Prof. Dr. -Ing Jörg Franke.
Richard Vereijssen Product Marketing Manager of Yamaha Motor Europe Robotics business, commented, “FAPS’ 3D MID program is closely connected with our vision for the future and we are pleased to help tomorrow’s engineers gain the insights they need through hands-on experience.” He added, “It’s a learning opportunity for us, too, as we continue to develop future generations of equipment and services to support our commercial customers.”
Yamaha’s S20 modular hybrid mounter, as supplied to FAPS, is currently the main standard for 3D MID production. The machine combines a 3D robot manipulator with multiple dispenser heads and surface-mount pick-and-place heads to consolidate solder-paste and/or adhesive dispensing with component placement on the same platform. In addition to saving footprint and streamlining 3D MID assembly, the S20 also boasts easy programming to simplify and accelerate prototyping as well as mass production.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.