Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Saki Corporation Announces Chicago ‘Solution Center’
November 2, 2020 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is delighted to announce the inauguration of its Solution Center in the United States of America. The new Center, which is fully equipped with the latest factory automation solutions, is conveniently located centrally in the US at Saki’s Chicago office and augments the company’s existing West Coast facility in Fremont, California.
Saki’s new US-flagship ‘Solution Center’ hosts a variety of factory automation solutions, advanced services and capabilities. In addition to new demonstration facilities showcasing the company’s state-of-the-art Automatic Optical Inspection, Solder Paste Inspection and X-ray Inspection machines, the Solution Center provides a variety of data analytics and Smart Factory connectivity solutions.
The new ESD-safe showroom and demonstration area features six Saki AOI, SPI and AXI systems alongside the company’s software solutions such as its Editor offline teaching station, Monitor remote verification station, Manager automatic program changeover and MPV (multi process view) solutions, as well as screen printing and stencil cleaning systems from partner companies.
Jeff Mogensen, General Manager of Saki America, stated: “Being able to provide this level of capability is unique in our industry. It represents the culmination of Saki’s 26-year history in developing industry leading technologies and services. The set-up of the Solution Center in Chicago has been expertly overseen by Charlie Chavez, Jason Ricker, Robert Barrett and Cleve Williams, who have worked tirelessly to ensure that customers have access to our state-of-the-art technology hub for the Americas region. With services ranging from applications testing, wet processing, X-ray analysis and machine programming solutions, we are poised to help customers attain new levels of productivity and competitiveness."
Saki’s US growth plans include establishing new and strengthening existing strategic partnerships with complementary equipment partners and subject experts to support customer processes and applications, and to create special events. Alongside one-to-one support in applications testing and design evaluations, the new flagship premises afford a generous capacity to host events for industry organizations, allowing group sizes up to 100 people for technical seminars, training programs and technology workshops.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.