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MacDermid Alpha to Present Power Package Attach by Silver Sintering at PCIM Asia
November 4, 2020 | MacDermid Alpha Assembly DivisionEstimated reading time: 1 minute
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting the paper, “Power Package Attach by Silver Sintering – Process, Performance & Reliability“ at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.
As silver sintering replaces solder at the die level (both for die attach and for top side attach), the bottleneck for further power cycling and overall thermal improvement is shifting to base-plate and heat sink levels. Due to the large areas involved, the higher CTE mismatch and the module´s inherent temperature dependent warpage, silver sintering at these levels brings specific process and reliability challenges. These challenges will be addressed in MacDermid Alpha’s paper presentation. As an alternative to printing, MacDermid Alpha will introduce a novel large area dispense process for silver sintering paste application that is particularly well suited for larger transfer-molded power packages. The process windows for drying and sintering will be defined, as well as their effect on joint integrity through die shear, acoustic microscopy, and thermal shock reliability testing. As well as discussing sintering paste, the paper will also demonstrate the use of novel sintering preforms that eliminate the paste application and drying steps altogether.
Wilson Wu, Application Manager – Die Attach, will be presenting the paper at 15:30pm on Tuesday, November 17th at Room 1 “Advanced Packaging Technologies” at Shanghai World Expo Exhibition and Convention Center Shanghai. For more information on Alpha’s Power Electronics and Assembly solutions, visit MacDermidAlpha.com.
PCIM Asia Conference 2020
Date: November 17, 2020 (Tuesday)
Time: 15:30 – 15:50
Venue: Room 1, Shanghai World Expo Exhibition and Convention Center Shanghai, China
Topic: Power Package Attach by Silver Sintering – Process, Performance & Reliability
Speaker: Wilson Wu, Application Manager - Die Attach
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
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