It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
Ormet Circuits Inc. Introduces New Transient Liquid Phase Sintering Paste
November 9, 2020 | Ormet Circuits, Inc.Estimated reading time: Less than a minute
Ormet Circuits Inc., a division of EMD Performance Materials, announced the introduction of its new Ormet® DAP-491-1 Transient Liquid Phase Sintering (TLPS) paste. TLPS pastes are lead-free and high-temperature stable sintering solder systems for semiconductor packaging and assembly.
Ormet DAP-491-1 is a Pb-free, TLPS paste formulated for attachment of metalized die to metalized substrates. It is processed via lead-free reflow but exhibits extremely high thermal stability beyond 350°C after sintering and will withstand subsequent lead-free reflow temperatures above 260°C without re-melting.
Ormet DAP-491-1 is an excellent alternative to gold-based and lead-based solders as well as silver-sintering materials for electronic packaging applications requiring high thermal conductivity, high-temperature stability along with standard SMT-compatibility for high-throughput.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
SASinno Americas Introduces the Ultra Series
10/07/2025 | SASinno AmericasSASinno Americas has introduced the new Ultra Series, the latest generation of offline selective soldering systems. Available in two models—the Ultra-i1 and Ultra-i2—the new series is designed to meet the needs of manufacturers running small to medium batch sizes, multiple product types, and frequent line changes, while maintaining exceptional precision and process control.
Elmotec by E-Tronix to Showcase SolderSmart® TOP Robotic Soldering at The Assembly Show 2025
10/06/2025 | ELMOTECE-tronix, a Stromberg Company, is pleased to announce its participation at The Assembly Show 2025 in Rosemont, IL, October 21st through 23rd. Exhibiting under Elmotec by E-Tronix, Booth #448, the team will highlight the SolderSmart® TOP robotic soldering system, featuring live demonstrations throughout the show.