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Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics

10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics Solutions
As power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).

The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics

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Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages

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Target Condition: Rethinking the PCB Stackup Recipe

10/01/2025 | Kelly Dack -- Column: Target Condition
Marie Antoinette is attributed with saying, “Let them eat cake,” but historians now agree she likely never said it. It was probably revolutionary propaganda to paint her as out of touch with the starving masses. Yet, the phrase still lingers, and oddly enough, it applies to the world of PCB design.

Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025

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Empower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.
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