3DGS Technology Used by Nokia to Demonstrate World’s First D-Band
November 20, 2020 | 3D Glass SolutionsEstimated reading time: 1 minute
3D Glass Solutions, Inc. (3DGS), a leading innovator of glass-based, three-dimensional passive RF devices, has collaborated with Nokia, a global leader in 5G solutions, to deliver a breakthrough in D-band signal transport.
D-band signal transport requires highly integrated and cost-effective mm-wave modules with high spectral-efficiency. 3DGS worked with Nokia to develop a demonstrator for ultra-high performance >30Gbps speed Wireless backhaul systems.
“This solution allows designers in D Band TX/RX modules the lowest loss and lowest cost point for TX/RX modules, as demonstrated by this Radio-on-Glass architecture for Nokia operating up to 160GHz with less than 1dB of loss from the chip to the antenna output/input ports,” said 3DGS CTO, Jeb Flemming.
“One of the reasons we’ve been able to achieve such extraordinary performance numbers using our RFIC on glass is because we’ve been working closely with the engineers at 3DGS,” said Shahriar Shahramian, Director of Sensing and Communication ASICs Research at Nokia Bell Labs. “Its unique etching process allows us to build things on glass that simply aren’t possible using any other process.
At the same time, 3DGS’ willingness to collaborate and explore unexplored areas and applications has allowed us to build something incredible.”
This is the next generation of ultra-high-performance Radio-on-Glass modules operating at these frequencies,” said Jeb Flemming. “Our demand for data continues to grow, and we are pleased to work with Nokia to deliver record-breaking solutions that can keep up with that demand.”
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Element Solutions Declares Q3 Dividend of $0.08 Per Share
08/22/2025 | BUSINESS WIREElement Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.
MacDermid Alpha Electronics Solutions Announces New Strategy Vice President Role for India
08/14/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is pleased to announce the appointment of Dr. Ravi Bhatkal to the newly created role of Vice President, Strategy, India.
Changes in Management Positions at Würth Elektronik eiSos Group
08/14/2025 | Wurth Elektronik eiSosWürth Elektronik, a leading manufacturer of electronic and electromechanical components for the electronics industry, announces two new appointments at the management level: Dirk Knorr has taken over the position of COO of the Würth Elektronik eiSos Group, and Sebastian Valet has taken over his previous position as Managing Director of Würth Elektronik eiSos GmbH & Co. KG.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/14/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.