-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MacDermid Alpha Releases HELIOFAB AG 7921 High-Brightness Silver for Leadframe Based LED Packages
November 27, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of HELIOFAB AG 7921, a high brightness silver electroplating process for leadframe based LED packages.
Reflectivity of the leadframe surface is a key factor in LED packaging design. Leadframe based LED package manufacturers require a high brightness silver spot plating process that ensures a proper surface for die attach and wire bonding during assembly. The silver finish must also provide lasting reflectivity during end use performance.
MacDermid Enthone’s HELIOFAB AG 7921 spot silver electroplating process consistently deposits highly reflective silver with measured GAM values around 2.0 over a wide current density window of 10 to 70 ASD. The bath produces a stable deposit over the standard 100 AH/L industry bath life metric. The deposit passes all standard testing for LED performance such as 1000-hour luminous decay as well as assembly functional testing for gold wire bond pull and die attach shear strength. The process is currently in high volume production and is specified for OEM use in leadframe LED manufacturing.
“With the release of HELIOFAB AG 7921 we have further broadened our comprehensive portfolio of solutions for leadframe based packages and look forward to helping customers solve manufacturing issues with this highly important and versatile type of IC packaging. The innovative white bright deposit provided by HELIOFAB AG 7921 delivers enhanced LED performance while reducing manufacturing costs through spot plating selectivity.” – Rich Retallick, Director of Electronics Specialties, Circuitry Solutions.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Suggested Items
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
KYZEN’s Adam Klett to Keynote at SMTA Electronics in Harsh Environments Conference
05/07/2024 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, announced today that KYZEN’s Director of Science, Adam Klett, PhD will present as a keynote speaker at the SMTA Electronics in Harsh Environments Conference. The event is scheduled to take place May 14-16, 2024 at the Technical University of Denmark in Copenhagen, Denmark.
Altus Equips SSTL with Advanced Cleaning Technology for Electronics
05/07/2024 | Altus GroupAltus Group, a leading supplier of capital equipment for the electronics manufacturing industry, has announced the successful installation of an advanced PCBA cleaning system at Surrey Satellite Technology Limited (SSTL).
GPV's Handover of Refurbished Factory Building
05/07/2024 | GPVOn 6 May 2024, Bjorn Fiskers, MD at GPV Electronics TH in Thailand and his team were handed the keys to our refurbished factory building, adding another 7,000 sqm to our current 15,000 sqm electronics factory. Our electronics factory in Thailand will comprise of a total of 22,000 sqm.
New Yorker, Major League Electronics Sign New Franchised Distribution Agreement
05/06/2024 | New Yorker Electronics Co.New Yorker Electronics, global distributor of electronic components, recently announced a new franchised distribution agreement with Major League Electronics, renowned manufacturer of interconnect products.