Flexible Thinking: Rules of Thumb: A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
CHASM Expands Executive Leadership Team
December 3, 2020 | PRWEBEstimated reading time: 1 minute
CHASM Advanced Materials Inc, a leading developer and manufacturer of proprietary advanced materials hybridized at the nanoscale, announced the appointment of Mark Lunsford as Vice President of Global Sales to lead CHASM’s sales operations. An accomplished tech industry executive, Lunsford has more than 35 years of experience and has helped drive rapid growth for companies ranging from start-ups to multi-billion-dollar enterprises. Lunsford reports to CHASM's Chief Revenue Officer, Kenneth Klapproth.
In this role, Lunsford assumes responsibility for worldwide revenue generation of the Company’s Printed Electronics, Advanced Carbons, and Advanced Membranes business units. In addition to direct sales, Mark heads commercial operation of CHASM’s Preferred Integration Partner (PIP) network and international distribution partner including Henkel, CCI Eurolam, A-Gas, Meisei and Daekyung Hichem Co, Ltd.
“Mark is joining CHASM at an opportune time with customer interest nearly doubling year-over-year to the point where our funnel of sales opportunities exceeds $100 million,” said David Arthur, CHASM CEO and Co-Founder. “We have reached a tipping point in both direct sales and through our channels where a strong sales leader such as Mark can drive scalability in our process. His deep experience in the industry and familiarity with the cultural differences of selling internationally will be instrumental to achieving our vision and reaching our business growth objectives.”
Prior to joining CHASM, Lunsford served as EVP of Worldwide Sales at SiTime, a market leader in silicon MEMS timing devices used in nearly all electronics today. Consistently outpacing industry growth rates at companies such as NXT, Micrel Semiconductor, AMD and Pivotal Technologies, Mark has a strong track record of driving productive business development teams.
“I am fascinated by CHASM’s tremendous technology platform, and I am convinced it addresses a substantial market need for any company looking to innovate next-generation electronic devices. I am extremely excited to join the talented team at CHASM as we are uniquely positioned to deliver cutting edge printed electronics solutions to disrupt the status quo within this industry,” said Mark Lunsford.
Lunsford holds a Bachelor’s degree in Mechanical Engineering from University of California, Davis and did his Master’s work in Electrical Engineering and Engineering Management at Santa Clara University.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.