IPC APEX EXPO 2021 Goes Virtual
December 8, 2020 | IPCEstimated reading time: 1 minute

IPC APEX EXPO 2021 will be offered virtually, March 8-12, 2021.
“Given ongoing COVID-19 health and safety concerns and continued restrictions for large gatherings and events in California, it was not feasible to safely convene the nearly 9,000 expected participants at IPC APEX EXPO 2021,” said IPC President and CEO John Mitchell. “The event will now take place in a safe, all-virtual format.”
While the event is going virtual, IPC APEX EXPO will still be the place to connect, collaborate and learn as the event’s virtual platform will allow attendees, exhibitors and speakers to easily navigate more than 100 technical conference sessions and professional development courses as well as product demonstrations, and schedule one-on-one meetings with exhibitors. As an added bonus, technical conference sessions will be available to registered attendees for replay, providing a unique opportunity to take advantage of education for 90 days after the event.
And rounding out the immersive experience, attendees can attend multiple keynotes, a “meet and greet” with IPC Hall of Famers and Emerging Engineers, participate in a virtual trivia event, and learn about cutting edge products and technologies during daily exhibitor new product introductions.
Mitchell added, “Be it in person or via an online platform, it is IPC’s goal to maintain IPC APEX EXPO’s position as the premier event for the electronics manufacturing industry, providing practical applications for learning – knowledge that attendees can immediately apply to their work and as well as far-reaching insights that can be applied toward implementing future technologies. Wherever in the world you may be located, IPC APEX EXPO 2021 is the place to be.”
Registration for IPC APEX EXPO 2021 is expected to open December 17. To view schedule at a glance and exhibitor list, visit www.ipcapexexpo.org. IPC APEX EXPO will return to an in-person format in 2022 and will take place January 25–27, 2022 at the San Diego Convention Center.
Suggested Items
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.
New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
04/29/2025 | IPCIPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.
Choosing the Right Strategic Path
04/29/2025 | Marcy LaRont, PCB007 MagazineTom Yang, CEO of CEE PCB, discusses the current economic challenges, noting reduced purchasing power post-pandemic. He highlights the growing demand for HDI in consumer electronics due to AI growth. Tom also expresses concerns about tariffs under the new U.S. administration, prompting CEE to diversify production locations, including new plants in Southeast Asia. He emphasizes the need for PCB manufacturers to adapt strategically amidst rising costs and fierce competition, particularly for mid-sized shops facing unique challenges in the industry.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.
IPC Strengthens Global Leadership Team with Addition of Joe Schneider as Vice President of U.S/Canada
04/25/2025 | IPCIPC, the global electronics association, announces the strategic appointment of Joe Schneider as vice president of U.S./Canada. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to this region’s innovation and economic growth.