-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Altus Boosts Laser-Based Solutions with LPKF Technology
December 11, 2020 | LPKFEstimated reading time: 1 minute

Altus, a leading distributor of capital equipment in the UK and Ireland, has announced an exciting new partnership with technology and innovation leader, LPKF. The agreement involves the distribution of LPKF’s highly innovative laser-based solutions for the technology industry.
This new collaboration will further enhance Altus’ capital equipment portfolio with a range of highly-advanced laser systems that are vital in the manufacture of printed circuit boards, microchips, automotive parts, solar panels and many other components.
As components shrink in size, but quality and precision still paramount to reliability, LPKF’s cutting-edge laser-based depaneling technology is essential to successful production.
‘’Working with LPKF is a perfect match for us at Altus,” said Joe Booth, Altus Director - Business Development and Marketing.
“We are very excited about the laser routing/de-panelling process here in the UK and Ireland, as we see a large increases in flexi-rigid applications and a growing trend for PCBAs of this type moving forward.
“LPKF is the out and out leader in this field with a wealth of application knowledge and highly respected performance. The combination of this new partnership, together with our established customer pool and top quality support, we can only see that number of installations growing. This addition also sees Altus provide the market leading technology in both laser and milling depaneling processes allowing us to offer customers the very best solutions to meet their specific requirements.‘’
Laser depaneling is one of the most innovative processes to separate printed circuit boards from a panel. With traditional depaneling methods, assembled PCBs are cut out of the panel using a mechanical separation process. With laser depaneling, the depanelisation process is performed using a focused laser beam that ablates the material layer by layer. The laser process, especially in case of LPKF equipment, offers considerable advantages over conventional mechanical cutting processes.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.