Altus Boosts Laser-Based Solutions with LPKF Technology
December 11, 2020 | LPKFEstimated reading time: 1 minute

Altus, a leading distributor of capital equipment in the UK and Ireland, has announced an exciting new partnership with technology and innovation leader, LPKF. The agreement involves the distribution of LPKF’s highly innovative laser-based solutions for the technology industry.
This new collaboration will further enhance Altus’ capital equipment portfolio with a range of highly-advanced laser systems that are vital in the manufacture of printed circuit boards, microchips, automotive parts, solar panels and many other components.
As components shrink in size, but quality and precision still paramount to reliability, LPKF’s cutting-edge laser-based depaneling technology is essential to successful production.
‘’Working with LPKF is a perfect match for us at Altus,” said Joe Booth, Altus Director - Business Development and Marketing.
“We are very excited about the laser routing/de-panelling process here in the UK and Ireland, as we see a large increases in flexi-rigid applications and a growing trend for PCBAs of this type moving forward.
“LPKF is the out and out leader in this field with a wealth of application knowledge and highly respected performance. The combination of this new partnership, together with our established customer pool and top quality support, we can only see that number of installations growing. This addition also sees Altus provide the market leading technology in both laser and milling depaneling processes allowing us to offer customers the very best solutions to meet their specific requirements.‘’
Laser depaneling is one of the most innovative processes to separate printed circuit boards from a panel. With traditional depaneling methods, assembled PCBs are cut out of the panel using a mechanical separation process. With laser depaneling, the depanelisation process is performed using a focused laser beam that ablates the material layer by layer. The laser process, especially in case of LPKF equipment, offers considerable advantages over conventional mechanical cutting processes.
Suggested Items
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Hon Hai Research Institute Achieves Breakthrough in Quantum Cryptography Recognized by Leading Global Conference
06/17/2025 | FoxconnHon Hai Research Institute (HHRI), the research arm of Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and technology service provider, has achieved a significant breakthrough in quantum computing.
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.