I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 11, 2020 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

This week’s mainstream news was dominated—well, my personalized online news feed was, at least—by ballistics. SpaceX was in the news daily for lobbing multiple pieces of iron, even as their CEO took his household suborbital, leaving California and touching down in Texas. Pandemic numbers charts continue their skyward trajectory worldwide. The ever-present military tests and technology demonstrations, seemed a bit more commonplace this week as well. Worldwide political news, in general, seemed to follow parabolic curves like an Australian boomerang, veering off in unexpected ways only to suddenly cut a curving path and return.
While the Editor’s Choice: Five Must-Reads this week might not be quite so ballistic as the mainstream, we had some big news, nonetheless. Here are the five news bombshells that we think deliver the biggest impact in electronics manufacturing this week.
ECWC15 Virtual Conference Keynote: 5G PCB Technology and Material Challenges
Published December 7
Even while under pandemic lockdown in the UK, I-Connect007 Technical Editor Pete Starkey took advantage of the virtual ECWC15 format to attend a keynote from Dr. Shiuh-Kao Chiang, managing partner of Prismark, describing the PCB technology and material challenges presented by the introduction of the fifth-generation cellular wireless communication network—the roll-out of which was continuing in spite of the coronavirus pandemic. Readers, understandably, flocked to Pete’s coverage of this important, but often hard-to-access industry conference.
IPC APEX EXPO 2021 Goes Virtual
Published December 8
We all secretly hoped that the timing would be such that IPC APEX EXPO 2021 would be the bookmark to the pandemic, which started just after the 2020 EXPO, and an ending would allow the 2021 version to proceed. Choosing a prudent path, IPC pivots APEX EXPO to a virtual event.
Chapter 1 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’
Published December 8
The micro I-007e book recently published by Anaya Vardya at American Standard Circuits, third in their series, is drawing significant readership. And this excerpt published in the Daily Newsletter did as well.
Training Is Hard, But It’s Also Soft
Published December 8
Blackfox’s Jahr Turchan encourages readers to look at workforce training not only from a certification perspective, but also from a people skills point of view–something that seems to resonate with readers as we all learn new ways to collaborate with our project teams and coworkers.
Special Operations Strives to Use the Power of Artificial Intelligence
Published December 8
From the article, “Project Maven was initially executed to automate the processing and exploitation of full-motion video collected by intelligence, instead of relying on humans to sort through all of it. With AI's ability to sift quickly through terabytes of data to find relevant pieces of intelligence, it allows the human to make faster and better informed decisions.”
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.