MacDermid Alpha Introduces Innovative Solder Paste Enabling Next Generation High Density Assembly Designs

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MacDermid Alpha Electronics Solutions, a global leader in soldering and electronics assembly technologies, is pleased to launch ALPHA^® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components. 

Developed to respond to the demands of increased miniaturization, ALPHA OM-372 is formulated to deliver low post reflow residue and superior transfer efficiency on fine feature pads as low as 80x130µm (008004).  ALPHA OM-372 shows excellent results in advanced SIR, demonstrating excellent electrochemical reliability with no denditric growth on low standoff packages. The solder paste is optimized for fine feature applications requiring Type 5 and Type 6 powders.

The combination of these best-in-class features as well as excellent HiP and NWO performance makes ALPHA OM-372 ideal for a broad range of high board density applications requiring smaller, thinner, and lighter form factor components, such as those found in mobile, wearable, and computer devices.

“ALPHA OM-372 serves a critical need as miniaturization drives complexity of board designs” said Paul Salerno, Global Portfolio Manager for SMT Assembly. “This paste not only meets the most challenging  fine-feature printing and reflow conditions, but provides superior electrochemical reliability performance required by these complex assemblies”.

For more information on ALPHA OM-372 Solder Paste, please visit MacDermidAlpha.com.

About MacDermid Alpha Electronics Solutions:

Through the innovation of specialty chemicals and materials under our Alpha, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.  Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.