-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
EnviroLeach Fully Subscribes $5.347 Million Private Placement
December 22, 2020 | ACCESSWIREEstimated reading time: 1 minute
EnviroLeach Technologies Inc., is pleased to announce that its previously announced non-brokered private placement has been fully subscribed. The Company has received subscriptions for 17,825,001 units (each a "Unit") at a price of $0.30 per Unit for total gross proceeds of $5,347,500. The Company is proceeding with transaction closing which, due to administrative contraints associated with year end and holiday hours, is anticipated to be completed by December 30, 2020.
EnviroLeach's executive team and board of directors wish to thank investors for their support and interest in this pivotal funding, which is allows the Company to execute its multi-faceted business strategy. EnviroLeach is in position to increase operational throughput at its EnviroCircuit printed circuit board processing facility, and to drive adoption of its economic and environmentally sustainable innovations in the gold mining sector.
The proceeds of the Private Placement will be used for the acquisition of feedstock for Enviroleach's printed circuit board assembly processing facility, the continued development of the Company's technologies, and general working capital.
The securities referred to in this news release have not been, nor will they be, registered under the United States Securities Act of 1933, as amended, and may not be offered or sold within the United States or to, or for the account or benefit of, U.S. persons absent U.S. registration or an applicable exemption from the U.S. registration requirements. This news release does not constitute an offer for sale of securities for sale, nor a solicitation for offers to buy any securities.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Partnerships Drive Innovation for a Brighter Manufacturing Future
08/26/2025 | Barry Matties, I-Connect007When Schweitzer Engineering Laboratories (SEL) opened its greenfield facility in 2023, it did so with careful attention to choosing its suppliers. In this discussion, Collin Peters, electronics business director for North America at MKS’ Atotech, and Justin Kennedy, manager of engineering at SEL, explore their unique partnership that includes collaborative efforts to develop innovative solutions like the Uniplate® PLBCu6 line.
Eltek Receives Purchase Orders Totaling $2.4 Million From Defense Contractor
08/25/2025 | PRNewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced that it received orders totaling $2.4 million from a defense customer.
TTM Technologies: Bridging East and West with Strategic Expansion
08/25/2025 | Marcy LaRont, I-Connect007As global supply chains shift and demand for supply chain resiliency grows, TTM Technologies is expanding with purpose: bolstering its U.S. presence while maintaining a strong footprint in Asia. With recent moves in Wisconsin and Malaysia, the company is positioning itself to better support customers amid an evolving geopolitical landscape. In this interview, President and CEO of TTM Technologies Tom Edman discusses TTM’s expansion strategy, the future of manufacturing, and his planned retirement after his long tenure at the helm of the company.
CIMS to Exhibit at KPCA Show 2025
08/25/2025 | CIMSCIMS announced that it will exhibit at KPCA 2025, Korea’s premier annual PCB event, held this year in Incheon.
Global Flexible PCB Output Expected to Surpass $20 Billion by 2025, with AI Glasses Emerging as a New Growth Driver
08/25/2025 | TPCAThe Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute (ITRI) released the "2025 Global Flexible PCB Industry Outlook" in August.