-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Olympus, Hitachi Collaborate on Endoscopic Ultrasound Systems
January 6, 2021 | JCN NewswireEstimated reading time: 1 minute
Olympus Corporation and Hitachi, Ltd. have signed a five-year contract to jointly develop Endoscopic Ultrasound Systems (EUS). Hitachi will also continue to supply diagnostic ultrasound systems and related parts used in EUS to Olympus under this contract.
EUS consist of a diagnostic ultrasound system and ultrasound flexible endoscopes. They are used in examinations to evaluate the stage of cancer in the liver, pancreas and bronchus, as well as in minimally-invasive care, contributing to the medical treatment.
Hitachi's diagnostic imaging-related business is expected to be transferred to FUJIFILM Corporation, subject to customary closing conditions and regulatory approvals. The agreement between Hitachi and Olympus will be valid after such transfer.
Hironobu Kawano, Division Head of the Endoscopic Solutions Division, Olympus Corporation, said, "Olympus aims to improve patients' quality of life through early diagnosis made available with Endoscopic Ultrasound Systems. Our long-standing partnership with Hitachi has built a strong foundation of products and technology development for endoscopic ultrasound diagnosis, and we are very excited to be able to continue this collaboration and contribute further to improving patients' lives. Through this ongoing collaboration, Hitachi and Olympus will introduce products and technology that address the needs of the patients, healthcare professionals and the broader medical industry."
Toshihiko Kawano, CTO of Healthcare Business Unit, Hitachi, Ltd., said, "It is our pleasure to continue our collaboration with Olympus in the EUS business. Since the development of the first EUS product in the 1980s, Olympus and Hitachi have always been at the forefront in the market and have contributed significantly to progress the level and quality of treatment for digestive and respiratory diseases around the world. We look forward to collaborating in the future and exploring new clinical values to provide better diagnosis and treatment to patients and healthcare professionals, and contribute to the advancement of medical treatment."
Suggested Items
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
05/01/2025 | Summit Interconnect, Inc.Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system.
New High Power 3D AXI for Power Electronics from Test Research, Inc.
04/17/2025 | TRITest Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.
Real Time with... IPC APEX EXPO 2025: MivaTek is Revolutionizing Circuit Board Manufacturing with DART Technology
04/02/2025 | Real Time with...IPC APEX EXPOBrendan Hogan from MivaTek Global discusses the company's focus on direct imaging for circuit boards and semiconductors. MivaTek is introducing DART technology for dynamic feature size adjustments. This technology enhances precision, improving registration and throughput.