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Advanced Electronics Packaging Digest

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Wizerr Launches Engineering AI for Component Manufacturers

09/01/2026 | BUSINESS WIRE
Wizerr AI announced the expansion of its ELX component intelligence engine to component manufacturers.

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

08/26/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will participate in the 37th Annual Electronics Packaging Symposium (EPS), September 9-10, 2026, at the Center of Excellence Building within Binghamton University’s Innovative Technologies Complex in New York.

HIROSE Electric Americas President Mark Kojak Named to ECIA Manufacturer Council

08/20/2026 | HIROSE Electric Americas
HIROSE Electric Americas is pleased to announce that Mark Kojak, President of HIROSE Electric Americas, has been named to the Electronic Components Industry Association’s (ECIA) Manufacturer Council.

Viscom to Showcase the Next Generation of AI-Powered Inspection at SMTA International 2026

08/14/2026 | Viscom Inc.
At SMTA International 2026, Viscom Inc. will present how artificial intelligence is changing the way electronics manufacturers approach automated quality inspection – from intelligent programming to increasingly autonomous inspection processes. 

It’s Only Common Sense: The Golden Age of Electronics Manufacturing Has Already Begun

08/17/2026 | Dan Beaulieu -- Column: It's Only Common Sense
If you spend too much time reading headlines, you could easily come away believing that manufacturing is struggling, electronics is losing ground, and the best days of our industry are behind us. We hear about supply chain disruptions, labor shortages, geopolitical uncertainty, rising costs, or global competition. It is enough to make even experienced professionals wonder what comes next.
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