-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Qualcomm, NIO Bring Immersive Driving Experiences with Intelligent Cockpit, 5G Technologies
January 11, 2021 | Qualcomm IncorporatedEstimated reading time: 2 minutes
Qualcomm Technologies, Inc. and NIO Inc., through its subsidiary NIO USA, announced the companies’ working relationship to feature the latest next generation digital cockpit technologies in NIO’s first flagship sedan, the NIO ET7. Available in 2022, NIO ET7 will feature the 3rd Generation Qualcomm® Snapdragon™ Automotive Cockpit Platform and Qualcomm® Snapdragon™ Automotive 5G Platform, bringing intelligent and immersive in-vehicle experiences to consumers. By leveraging Qualcomm Technologies’ leading technological innovation and automotive product portfolio, this working relationship aims to bring more intuitive and immersive digital cockpit experiences enabled by high-performance computing and 5G technologies to users, driving accelerated transformation towards 5G intelligent and connected vehicles.
As Qualcomm Technologies’ first-announced artificial intelligent (AI)-based scalable automotive-grade digital cockpit platforms, the 3rd Generation Snapdragon Automotive Cockpit Platforms support the capabilities of high-performance computing, immersive graphics, multimedia and computer vision. The 3rd Generation Snapdragon Automotive Cockpit Platform is designed to deliver highly intuitive AI experiences on the NIO ET7 and rich visual experiences with support for multiple displays throughout the vehicle, providing the NOMI in-car AI system, as well as interactions on in-vehicle displays with exceptional support for heterogenous computing capabilities.
The Snapdragon Automotive 5G Platform is the industry’s first-announced automotive-grade 5G dual SIM dual active (DSDA) platform with comprehensive, industry-leading 5G connectivity capabilities. Coupled with advanced features such as C-V2X and high-precision positioning, the platform can effectively support automakers like NIO to develop faster, safer and differentiated telematics products for the next-generation connected vehicles. Based on the Snapdragon Automotive 5G Platform, NIO ET7 can provide rich applications and immersive emotional experiences, enabling more intelligent connectivity and autonomous driving use cases.
“To continuously bring better experiences to users through technological innovation is the aspiration of NIO,” said Xin Zhou, Executive Vice President and Chairman of Product Committee, NIO. “This collaboration between NIO and Qualcomm Technologies in smart cockpit and 5G will help drive immersive interactive experiences to users that exceed expectations and drive automotive innovation in the future.”
“NIO and Qualcomm Technologies share the same aspiration for technological innovation and superb user experiences. We’re excited to work closely with NIO to support smart mobility designed to deliver exceptional digital cockpit and new driving experiences to users with our 3rd Generation Snapdragon Automotive Cockpit and 5G Platforms,” said Nakul Duggal, senior vice president and GM, automotive, Qualcomm Technologies, Inc. “Together, we look forward to driving connected vehicles into the 5G era, enhancing driving safety and paving the way for the arrival of next-generation intelligent vehicles.”
Suggested Items
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
Microsoft’s Brad Smith Urges U.S. Leadership in Quantum Technology
04/29/2025 | I-Connect007 Editorial TeamIn a blog post published on April 28, 2025, Brad Smith, Vice Chair and President of Microsoft, underscores the critical need for the United States to accelerate investment in quantum technology. While public focus remains fixed on artificial intelligence, Smith argues that quantum computing is an equally vital frontier with the power to revolutionize industries and solve complex global challenges across science, medicine, energy, and agriculture.
Visteon, Qualcomm Redefine Next-Generation AI-based Intelligent Cockpit Experience
04/28/2025 | PRNewswireAt Auto Shanghai 2025, Visteon Corporation, a global leader in automotive cockpit electronics, and leading automotive technology company, Qualcomm Technologies, Inc., announced a technology collaboration to bring groundbreaking capabilities to the automotive industry with Visteon's new high-performance cockpit system, powered by Visteon's automotive artificial intelligence (AI) framework, cognitoAI, and Qualcomm Technologies Snapdragon® Cockpit Elite Platform.
Mitsubishi Electric, Nanofiber Quantum Technologies Launch Trial to Develop Quantum Computer Interconnection Technology
04/25/2025 | BUSINESS WIREMitsubishi Electric Corporation and Nanofiber Quantum Technologies Inc. (NanoQT) announced today the immediate launch of a joint demonstration aimed at establishing interconnection technologies for neutral-atom quantum computers.