Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
CCL Firm ITEQ Posts 6.8% YoY Revenue Growth
January 11, 2021 | ITEQ CorporationEstimated reading time: Less than a minute
ITEQ Corp., one of the leading manufacturers of high-performance copper clad laminate (CCL) materials used for the fabrication of printed circuit boards (PCBs), has reported sales of NT$2.1 billion ($75.5 million at $1=NT$28.03) for December 2020, up by 4.72% year-on-year. Compared with the previous month, sales was up by 4.46%.
Total sales for 2020 reached NT$25.4 billion ($906.8 million), up by 6.8 percent from 2019.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
American Standard to Participate in European Microwave Week 2025
09/05/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.
HDI PCB Market Poised for Explosive Growth, Projected to Hit $34.23 Billion by 2032
09/04/2025 | Globe NewswireAccording to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching USD 19.59 Bn in 2025 and USD 34.23 Bn by 2032.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/04/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Talking with Tamara: Floor Planning Policies
09/04/2025 | Andy Shaughnessy, Design007 MagazineTamara Jovanovic is an electrical engineer with Masimo, a medical equipment manufacturer. She’s been designing PCBs for seven years and earned a master’s degree in electrical engineering in 2022. I asked Tamara to share her thoughts on floor planning—the challenges, techniques, and advice for designers setting up floor planning strategies.