-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueTechnology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Geely Holding Group, Foxconn Form Joint Venture
January 14, 2021 | FoxconnEstimated reading time: 2 minutes
Zhejiang Geely Holding Group and Foxconn Technology Group signed a strategic cooperative agreement and will establish a joint venture company to provide OEM and customized consulting services relating to whole vehicles, parts, intelligent drive systems, automotive ecosystem platforms to global automotive enterprises and ridesharing companies.
The new joint venture will revolutionize the automotive industry model by introducing the Information and Communication Technology (ICT) division of labor to help automakers accelerate their transition to new innovative and efficient manufacturing processes and business models based on CASE (Connected, Autonomous, Shared, and Electrified) technologies.
Terry Gou, Founder of Foxconn, and Li Shufu, Chairman of Geely Holding Group, attended and witnessed the digitally held signing ceremony. Young-way Liu, Chairman of Foxconn and An Conghui, President of Geely Holding Group, President and CEO of Geely Auto Group, signed the agreement on behalf of the two companies.
Each party to hold equal 50% stake in new joint venture. The board of directors will consist of five members with Foxconn appointing three including the Chairman and Geely Holding appointing two.
“This alliance between Geely Holding and Foxconn represents a milestone in cooperation between the automotive industry and ICT industry. With Foxconn’s globally leading R&D technologies, intelligent manufacturing, and hardware-software integration capabilities, the two parties form a highly complementary partnership which allows us to better serve and meet the diverse needs of different customers, and offer the most advanced, fastest, cost-effective full value-chain vehicle production service platform,” said Young-way Liu, Chairman of Foxconn Technology Group.
“The partnership with Geely Holding does not just align with our company’s vision of “3+3=?” which symbolizes the infinite possibilities created by Foxconn’s industrial advancement and emerging technologies, it will also result in tremendous change in the development of the automotive industry. I look forward to the great potential that this partnership will bring about.”
“This cooperation is of great significance to both parties. The current global automotive industry is undergoing profound changes. We must actively embrace change, build alliances, and synergize resources to create greater value for our users. Foxconn’s professional capabilities, rich experience, and global layout in the ICT industry offer important insight for the transformation and evolution of the automotive industry. Geely Holding Group will give full play to its advantages in the automotive fields of design, engineering, R&D, intelligent manufacturing, supply chain management, and quality control while joining forces with Foxconn to develop together and explore new pathways for transforming, improving, and achieving high-quality development of the manufacturing industry.” said Daniel Donghui Li, CEO of Zhejiang Geely Holding Group.
Suggested Items
Infineon Pioneers World’s First 300 mm Power Gallium Nitride (GaN) Technology
09/16/2024 | InfineonInfineon Technologies AG announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology.
ZESTRON to Exhibit & Present at Upcoming SMTA International 2024
09/13/2024 | ZESTRONZESTRON, the global leader in high-precision cleaning products, services, and training solutions for the electronics manufacturing industry, is excited to announce its participation in the upcoming SMTA International (SMTAI) (SMTAI) 2024.
SMTA International Announces Keynote Speaker: Jairek Robbins
09/13/2024 | SMTAThe SMTA International Conference & Expo is proud to announce Jairek Robbins as a keynote speaker at this year's event. He will be presenting on Wednesday, October 23 from 9:00 AM to 10:00 AM.
SEMI, IESA Join to Strengthen Semiconductor Ecosystem at SEMICON India 2024
09/12/2024 | SEMIIn a strategic move to further solidify India's position in the global semiconductor value chain, SEMI®, the global industry association that connects the semiconductor and electronics design and manufacturing value chain, has announced a strategic agreement with the India Electronics and Semiconductor Association (IESA), the leading industry body representing the electronics and semiconductor sectors in India.
Benchmark Celebrates Grand Opening of New, State-of-the-Art Facility in Penang, Malaysia
09/12/2024 | Benchmark Electronics Inc.Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, celebrated the grand opening of a new facility in Penang, Malaysia.