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In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 13, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 3 minutes
It’s Friday the 13th so here’s a little Friday morning trivia to start us off.
Did you know that Fridays the 13th can happen up to three times a year? Triskaidekaphobia is the fear or avoidance of the number 13. Most believe the bad feeling around this day to have Christian origins, specifically referring to the Last Supper where Judas Iscariot, who later betrayed Jesus to his captors, was the 13th guest to arrive at dinner. Now, as another week comes to an end, here are my five must-reads for the week.
At the top of my list is “Silicon to Systems,” an interview with technology experts from IPC: Matt Kelly, Devan Iyer, and Kris Moyer. Also, this week, we hear from I-Connect007 Managing Editor Nolan Johnson, who’s been in Mexico for SMTA Guadalajara. Speaking of Mexico, I want to highlight an interview that appeared in IPC Community between Lorena Villanueva and Barjouth Aguilar of Flex, who talk about the importance of sustainability. I wrap up my recommendations with articles about solder printing and wet process control. Be sure to click the links and share these important articles.
From Silicon to Systems
Published September 10
What does silicon to systems mean for PCB designers? “You don't hold a chip in your hand,” says IPC CTO Matt Kelly, who coined the term. “You don't even hold a component in your hand; you hold a cellphone in your hand, and for that system to work, while these components and changes are absolutely important, it's really just one part among many more that makes up the system you are using.” PCB instructor Kris Moyer states that PCB design teachers no longer have the luxury of teaching from the standpoint of a single device, but must consider the entire system. This is a cutting-edge conversation you don’t want to miss.
Grow, Pause, Grow: A Report From SMTA Guadalajara
Published September 12
“This week’s SMTA Guadalajara Expo and Tech Forum reflects that growth through the show’s rapid expansion and high-energy enthusiasm,” says Managing Editor Nolan Johnson, onsite this week at SMTA Guadalajara. Though the region seems to be experiencing a slight EMS pause, long-term investment remains strong, and the Mexico and the Southern region is poised for continued growth. This is a quick read.
A Leader in Sustainability: Talking With Barjouth Aguilar of Flex
Published September 9
In this interview originally published in IPC Community, Lorena Villanueva, director of IPC Mexico, discusses sustainability and the challenges that professional women in Mexico (and around the world) face in our industry. Having met Barjouth at Women’s IPC Day in Ciudad this past March, Lorena says Barjouth immediately became someone she both respected and admired. Barjouth is head of global sustainability at Flex and the Flex Foundation, and resides in Guadalajara, “the Silicon Valley of Mexico.” She talks about how she was clear in her desire to work for Flex and adds, “I have always had a goal of making a change in society, a real change, like fixing things I don’t like.” And she is getting to do just that through her sustainability work at Flex.
Scrutinizing Solder Printing
Published September 10
In this interview, Adam Murling and Dr. Ron Lasky of Indium discuss the pros and cons of solder jet printing and describe “solder jetting” as the next generation of solder dispensing. Solder jetting, says Murling, yields smaller, more consistent solder deposits and is faster than solder dispensing. They discuss solder formulation and metallurgic reliability, and plainly state, “Quality manufacturing isn’t cheap. Make sure you do your research so you are getting the right equipment for your manufacturing.”
Trouble in Your Tank: Things You Can Do for Better Wet Process Control
Published September 12
I love Mike Carano’s columns. He always states things truly and plainly. In his August column, he says, “As the level of complexity increases (higher layer counts, HDI and ultra high-density designs, and smaller footprint IC substrates, etc.), the process windows for wet chemical processing (etching, developing, and plating) are narrowing.” Things will always go wrong, he says, but you must have the systems in place to know whether those “things” are a special or common cause variables.
Suggested Items
Successful Rehm Technology Days 2024 – Where the Future Meets Technology
09/17/2024 | Rehm Thermal SystemsTraditionally, the Rehm Technology Days offer a valuable opportunity for knowledge exchange, networking and discussion. Once again this year, numerous customers, partner companies, press representatives and employees from the worldwide locations met at the company headquarters in Blaubeuren-Seissen.
Circuit Technology Center Announces Expanded Tinning Services Capacity
09/16/2024 | Circuit Technology CenterCircuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning.
The Knowledge Base: The Pivotal Role of Solder Paste
09/16/2024 | Mike Konrad -- Column: The Knowledge BaseIn the complex world of electronics manufacturing, the humble solder paste plays a pivotal role. Often overshadowed by more conspicuous electronics assembly equipment and materials, this blend of powdered metal and flux is the unsung hero that binds the electronic circuits together. But beyond its adhesive and conductive properties, the selection of the right solder paste is crucial for ensuring the long-term reliability of electronic devices.
Making Waves With Solder Paste Jetting
09/11/2024 | Josh Casper, Horizon SalesAs electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
Scrutinizing Solder Printing
09/10/2024 | Nolan Johnson, I-Connect007As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.