Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Futurist, Writer and Manufacturing Tech Expert Travis Hessman to Keynote IPC APEX EXPO 2021
January 18, 2021 | IPCEstimated reading time: 1 minute
Each year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2021 will feature IndustryWeek Editor-in-Chief Travis Hessman. During his keynote on March 10, Hessman will present, “The Great Digital Transformation.”
Hessman will educate keynote participants on the process undertaken by some of today’s most successful companies and what they are doing to transform a dizzying array of technologies such as connected machine-to-machine systems, machine learning and artificial intelligence into actionable, effective digital strategies. In addition, he will cover how they achieved greater operational efficiency and launched new products faster while improving product quality across their businesses.
Guided by Hessman, participants will navigate a roadmap to digital transformation that can help move their companies from the sidelines to the heart of the Factory of the Future -- The Industry 4.0 revolution.
As chief editor of IndustryWeek, Hessman offers a unique perspective on the digital manufacturing revolution as he is in daily contact with some of the world’s most successful and innovative manufacturers who are immersed in real-life implementation, application, and strategies for digital transformation success. His presentation will mix these perspectives with his background as a teacher, a mentor, and a writer to create a powerful storytelling experience that crafts a distinct narrative to help cut through the noise and hype and drive real progress for the industry. Later in the afternoon, Hessman will conduct a live, one-hour Q&A session with attendees who will have the opportunity to pose their own questions on digital transformation.
Hessman’s keynote is free to all IPC APEX EXPO participants. In addition to Hessman’s keynote, John Mitchell, IPC president and CEO and Shawn DuBravac, IPC chief economist, will deliver keynotes on March 8 and 11, respectively. The virtual conference, courses and online exhibition will run March 8–12, 2021. For more information on schedule and registration options, visit www.IPCAPEXEXPO.org.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.