The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
Electrical Wire Processing Technology Expo (EWPTE) 2021 Postponed
January 22, 2021 | IPCEstimated reading time: 1 minute
The 2021 Electrical Wire Processing Expo (EWPTE) originally scheduled at the Wisconsin Center in Milwaukee, Wisconsin for May 11-13, 2021 has been postponed to May 10-12, 2022. As show managers of the 2021 EWPTE, WHMA/IPC and Wisconsin Center District staff met with the newly formed EWPTE exhibitor advisory board. The advisory board comprised of representatives from the following companies: Amphenol CTI, Anixter, Artos, Brady Corporation, Cesar-Scott, DIT-MCO, Dynalab Test Systems, Hellermann Tyton, IEWC, Komax, Molex, Schleuniger Inc., Southwire Company, TE Connectivity and Telsonic unanimously made the critical decision to postpone the event due to ongoing concerns with COVID-19.
“Because of the extensive face-to-face networking and hands-on educational opportunities that EWPTE offers, the advisory board felt it was just not feasible to transition the event to a virtual one,” said David Bergman, WHMA executive director. “The past few years have drawn an expanded roster of exhibitors and visitors and the 2019 event saw close to 3,000 attendees from 40 states and 25 countries and nearly 200 exhibiting companies. We want to provide the electrical wire harness, wire and cable processing industries the cutting-edge and comprehensive in-person event they have come to expect the last 20 years in a safe environment.”
“My staff and I support the unanimous recommendation from the advisory board to postpone the show to 2022,” said Wisconsin Center District President and CEO Marty Brooks. “National and international participation for both exhibitors and attendees is what makes this show so comprehensive, so holding the event before international travel is reliable and safe would short sighted. I can’t wait to welcome everyone back to the Wisconsin Center in 2022.”
Information regarding the 2022 event will be available soon; visit www.electricalwireshow.com.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.