Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Tech Etch Installs Aqua Rose from Austin American Technology
January 25, 2021 | Tech EtchEstimated reading time: 1 minute
Tech Etch, a leading provider of custom flex and rigid-flex circuits, EMI/RFI shielding solutions, and precision etch & form, announced the purchase of an Aqua ROSE™ Batch Cleaner/Ionic Contamination Tester.
The Aqua ROSE batch cleaner offers multiple cleaning and testing technologies for capability previously unachieved in a compact footprint. In addition to aqueous and aqueous chemistry-based cleaning, the innovative Aqua ROSE™ supports process temperature ranges from ambient to 176°F. An intuitive user interface allows the operator to select the type and duration of wash, number of rinse cycles, and duration of the forced-air dry cycle.
“At Tech Etch we are innovating a better world, one part at a time. We do this by developing meaningful, long-term partnerships between our employee owners and the industry leaders we serve; and by ensuring unmatched precision, quality, and attention to detail in every project, every time. Our expertise in Flex and Rigid-Flex Circuits, Precision Etching and Forms, and EMI/RFI Shielding spans over 56 years, bringing experience and skill to every solution we build,” said Brian Crowell, Compliance Manufacturing Engineer at Tech Etch. “In addition to fabricating flex and rigid-flex circuits, we offer a variety of circuit assembly options. After soldering, it is critical to ensure product cleanliness, a task made easier and more reliable than ever with the implementation of the Aqua ROSE. AAT made the entire experience quick and easy – from offering online demonstrations during a pandemic, to installation and remote training. They never hesitated to step up and did not hold anything back. We are very happy to have partnered with Austin American Technology!”
Tech Etch is leading the way to help facilitate customers in the process of production by means of our state-of-the-art Innovation Center. The center is equipped with leading edge technology, expert engineering team, and top of the line software with the focus on quick prototyping. Tech Etch is your one stop shop to take your idea and get it to production.
Share on:
Suggested Items
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
SMTA Releases Final Batch of Training Resources Donated by Bob Willis
05/29/2025 | SMTAThe Surface Mount Technology Association (SMTA) announces the release of several more webinars, poster sets, and photo libraries to conclude a generous donation from renowned industry expert Bob Willis.
Altus Supports Phoenix Systems in Advancing THT Assembly with Robotic Soldering
05/27/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has successfully supported Phoenix Systems UK Ltd in its investment in robotic soldering technology to further enhance its through-hole technology (THT) assembly processes.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.