Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at APEX 2021 Virtual EXPO
February 9, 2021 | MirtecEstimated reading time: 3 minutes
MIRTEC, ‘The Global Leader in Inspection Technology,’ is pleased to announce its participation in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org.
“We are looking forward to participating in the IPC APEX Virtual EXPO,” stated Brian D’Amico, President of MIRTEC’s North American Sales and Service Division. “MIRTEC will feature video feed and information about our award-winning inspection solutions specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry.”
MIRTEC’s MV-6 OMNI 3D AOI Machine is configured with our exclusive OMNI-VISION® 3D Inspection Technology which combines 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary Digital Tri-Frequency Moiré 3D system in a cost-effective platform. MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems. MIRTEC’s Twelve (12) projection Digital Tri-Frequency Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera. There is little doubt that this new technology has set the standard by which all other inspection equipment is measured.
The MV-3 OMNI Desktop 3D AOI Machine is configured with the same hardware and software as MIRTEC’s in-line OMNI-VISION® 3D Inspection Systems providing 100% compatibility across MIRTEC’s entire 3D AOI product line. These systems feature our exclusive OMNI-VISION® 3D Inspection Technology which combines 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary Digital Tri-Frequency Moiré 3D system in a cost-effective platform. MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems. MIRTEC’s Twelve (12) projection Digital Tri-Frequency Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera. Without question, the MV-3 OMNI is the most Technologically Advanced Desktop 3D AOI machine in the world!
Smart Inspection Software using AI based on Deep Learning Methodology
MIRTEC’s Automatic Programming Software uses Artificial intelligence based Deep Learning Methodology to minimize human error and standardize the programming process. This advanced software solution automatically analyzes the PCB architecture and assigns the appropriate part type and process parameters for each SMT device thereby maximizing programming efficiency. Only basic operator training is required to achieve optimal inspection results.
MIRTEC’s ‘Best-in-Class’ Optical Character Recognition (OCR) Technology reduces false calls and improves production process efficiency by automatically restoring and inspecting damaged characters through AI and Deep Learning.
The Award-Winning MS-11e 3D SPI Machine is configured with an exclusive 15 Mega Pixel CoaXPress Camera System, providing enhanced image quality, superior accuracy, and incredibly fast inspection rates.
The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging, excessive Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, shape deformity, shift of deposition and bridging.
MIRTEC is Leading the Way to Industry 4.0
MIRTEC’s Total Remote Management System (TRMS) is a fully integrated Industry 4.0 Solution which combines remote management with real-time data monitoring and analysis for each system within the SMT production line. MIRTEC’s TRMS provides real-time remote monitoring of status information and statistical data such as equipment operation status, production yield, PC resources, temperature, humidity, etc.
The combination of MIRTEC’s 3D Inspection Systems and TRMS provide a vast improvement in production process management. The TRMS Module is a key part of MIRTEC’s Intelligent Factory Automation System, INTELLISYS®. This powerful software suite was designed and developed by MIRTEC to provide manufacturers with a clear view into the manufacturing process, thereby helping them achieve higher operating efficiencies and improved quality.
About MIRTEC
MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please visit www.mirtec.com
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
KYZEN Focuses on Aqueous and Stencil Cleaning Solutions at SMTA Monterrey Expo and Tech Forum
04/10/2026 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum.
Solder Paste Innovations for Enhanced Reliability from MacDermid Alpha Electronics Solutions
04/10/2026 | Real Time with... APEX EXPOJason Fullerton of MacDermid Alpha Electronics Solutions discusses innovative alloys like Innolot MXE, low-temperature solder options, and polymer reinforcement strategies. Learn how these solutions address the growing demands of high-performance computing and larger component assemblies, ensuring optimal performance and cost-effectiveness.
Frank Sommer Discusses Selective Soldering Innovations for EVs
04/10/2026 | Real Time with... APEX EXPODan Beaulieu sits down with Frank Sommer, a selective soldering expert from Nordson Electronics Solutions, to discuss the resurgence of selective soldering driven by electric vehicle manufacturing, and the need for robust through-hole component integration. He also introduces Nordson's innovative SELECT Synchro selective soldering machine, designed for enhanced throughput and flexibility.
Double Win: Indium Corporation’s CW-807RS and Indium12.9HF Receive EM Asia Innovation Honors
04/07/2026 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, recently received Electronics Manufacturing (EM) Asia Innovation Awards for its halogen-free CW-807RS flux-cored wire and Indium12.9HF solder paste products.