The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Ersa to Offer Demos in Interactive Virtual Showrooms during APEX Virtual EXPO
February 9, 2021 | Kurtz Ersa Inc.Estimated reading time: 1 minute
Kurtz Ersa Inc., the world leader of electronics production equipment, announced plans to participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Ersa has upgraded its demo/application centers to interactive virtual showrooms where the team will give customers in depth and personalized equipment demonstrations for wave soldering, reflow soldering, selective soldering, rework equipment, I4.0 connectivity and more. The company will highlight the EXOS 10/26, Ersa VERSAEYE and and HR 600 XL during the virtual event.
Ersa's EXOS 10/26 is a convection reflow soldering system with 22 heating and 4 cooling zones as well as a vacuum chamber after the peak zone, to remove voids in the solder contact areas between component and PCB surfaces. In addition to its extraordinary process reliability, the system impresses with its extreme ease of maintenance.
The Ersa VERSAEYE module enables the optimal documentation of solder joint quality on the basis of your individual quality requirements. Incorportaing it into Ersa’s industry leading VERSAFLOW selective soldering systems, the VERSAEYE is optimized for the inspection of THT solder joints. Through the use of up to nine camears it can detect detect different wetting prob-lems, solder bridges, solder balls or missed out pins.
With the Ersa HR 600 XL it is possible to professionally rework BTC components on big board assemblies. Boasting a heated area of 24 x 24" and a PCB thickness of up to 10 mm opens up rework capabilities in the segments of telecommunication, network and infrastructure. The high precision repair process is ideal for desoldering, placement and soldering of all types of surface mounted devices (SMD): BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF, etc.
For more information about Kurtz Ersa Inc., visit www.ersa.com.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.