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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
February 12, 2021 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
We’re moving on into 2021, and there’s quite a bit going on in the world of PCB design, fabrication, and assembly. IPC APEX EXPO is fast approaching, and I know a lot of you will be attending, albeit virtually. In this week’s Top Five, columnist Eric Camden provides a how-to guide for PCBA technologists planning their IPC APEX EXPO schedule. And we highlight an interview with members of USPAE about their new consortium dedicated to providing a safe supply chain for the DoD.
You can also read about IPC’s new digital twin standard, which provides a framework for managers interested in getting about the DT train. Joe Fjelstad reviews The Innovators, a technological history book written by Walter Isaacson. And Pulsonix continues its move into the North American market with its newest release, Pulsonix 11.0, which boasts up to 80% gains in speed, courtesy of new graphics functionality more commonly seen in the world of gaming.
Quest for Reliability: Here We Go (Virtual) Again
Published February 5
In this column, Eric Camden explains why virtual shows such as IPC APEX EXPO, despite their lack of in-person contact, can still be beneficial to SMT attendees. He discusses some of the assembly-related classes and task groups meeting during IPC APEX EXPO, and the need to plan your schedule wisely because of the multitude of sessions and events planned. As Eric points out, “One good thing about data is it stays the same no matter how it is presented.”
USPAE Launches $42M DoD Consortium
Published February 11
We have a terrific interview with Chris Peters, Kevin Sweeney and Shane Whiteside of the U.S. Partnership for Assured Electronics (USPAE). The group recently launched the Defense Electronics Consortium, an organization created with a $42 million DoD grant. They discuss the mission of USPAE and the consortium, which was created to ensure that the DoD always has access to a secure domestic electronics supply chain.
IPC Releases IPC-2551, International Standard for Digital Twins
Published February 8
There’s been a lot of talk about the “digital twin” lately, but how many of us know exactly what that term entails? What are the first steps for a company owner interested in moving to the digital twin model? IPC-2551, International Standard for Digital Twins, has the answers to these questions, and many more. This new set of frameworks defines the digital twin cell-based architecture and includes a self-assessment feature that lets managers understand their companies’ digital twin readiness level.
Joe Fjelstad's Book Review: The Innovators
Published February 8
Walter Isaacson is one interesting cat. This is a guy for whom CEO of CNN and editor of Time were mere stepping stones to his true calling in life: writer of non-fiction best-sellers. He’s particularly famous for his biographies of DaVinci, Einstein, Kissinger, and Jobs. Columnist Joe Fjelstad has a review of Isaacson’s book The Innovators: How a Group of Inventors, Hackers, Geniuses, and Geeks Created the Digital Revolution, which traces key developments in technology. If you like technological history, Joe says this book is for you.
Customers Experience Speed Increases of up to 80% on PCB Designs Using Pulsonix 11.0
Published February 9
UK-based Pulsonix has been making inroads into the North American EDA market, and this new release may help them in that endeavor. Many of the speed improvements, such as DRCs that are now four times faster, are the result of rewriting the graphics engine so that it can take advantage of the graphic cards used in the gaming industry. Take note: There’s a lot going on in the EDA world going into 2021.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.