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BTU to Show Vacuum Reflow Oven for Superior Profile Control at SEMICON China
February 22, 2021 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced plans to exhibit at SEMICON China, scheduled to take place March 17-19, 2021 at the Shanghai New International Expo Centre. The PYRAMAX™ Vacuum Reflow Oven will be displayed in the CohPros booth, Hall E7 #7343.
“We are excited to bring the great benefits of vacuum reflow to the China market,” said Ewing Hsieh, director sales Asia Pacific. “The award-winning PYRAMAX Vacuum is the best performing vacuum reflow oven available today for high-volume manufacturing applications where yield loss due to voiding cannot be tolerated.”
The PYRAMAX Vacuum reflow oven has been designed to meet the solder voiding requirements and high-volume demands of electronics assembly and semiconductor packaging applications. The unit is configured with 10 zones of closed-loop convection heating, two zones of convection vacuum chamber heat assist and an internal vacuum chamber heater for precise profile control. The vacuum chamber can accommodate a maximum product size of 18” by 18”. Nitrogen atmosphere capable, the PYRAMAX Vacuum reflow oven offers a maximum process temperature of 350° C.
About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
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Brent Fischthal - Koh YoungSuggested Items
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10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.