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Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
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Free Spanish Webinar: Optimizing Pin Inspection Using True3D™ Technology from Koh Young
February 25, 2021 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, along with its Mexico sales partner Repstronics will deliver a free webinar on Wednesday, 03 March 2021 at 11:00 a.m. CST (GMT-6). Register and secure your seat in the virtual event to learn from how to reduce costs and increase yields with Koh Young.
“Using our world-class True3D™ AOI technology, we designed the awardwinning KY-P3 to overcome pin inspection challenges like high false call rates and escapes,” commented featured speaker Gustavo Jimenez, Regional Sales Manager at Koh Young. “The KY-P3 provides an automated solution combining advanced high-resolution optics with innovative AI-powered vision algorithms for automated pin inspection. I look forward to discussing how our KY-P3 delivers unmatched inspection capabilities that directly help high-volume applications, including automotive and connector assembly,” concluded Gustavo.
Incorporating the world’s first full 3D quad-projection probe, the system delivers shadow-free measurement of SMDs and pins up to 25mm tall. Additionally, the “Stop-and-Go” movement allows it to capture 3D measurement data without system vibration, image stitching, or data interpolation. The KYP3s deliver reliable 3D measurement results with superior accuracy to boost your productivity and reduce costs.
Ideal for single pin, array, forked, press-fit, and more configurations, the KYP3 quickly and accurately measures pin height, presence/absence, offset, shoulder height (absolute and relative), and coplanarity. It also measures the critical distance between features in absolute and relative terms, as well as inner/outer wall distances and pin separation. The system is even capable of
solder paste height measurement and users are deploying it for Final Optical Inspection (FOI) of engine control units. Because the solution employs a quantitative measurement-based approach, the KY-P3 accuracy and repeatability are unsurpassed.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.