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Powering the Future: When Material Choice Defines RF Performance

06/10/2026 | Brian Buyea -- Column: Powering the Future
In RF and microwave design, deciding on which materials to use determines whether your design merely works or truly performs. Yet, designers too often fall back on material selection that is familiar, available, or “good enough.” However, once you move into higher frequencies, higher power densities, and tighter performance tolerances, “good enough” becomes the very thing that holds your design back. That’s where ceramic substrates become a fundamentally different approach to solving RF challenges.

Cadence, Intel Foundry Collaborate to Optimize Intel 14A Process for HPC and Mobile

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Why Cleanliness Is a Critical Reliability Driver

06/08/2026 | Mike Bixenman, Magnalytix
As electronic assemblies move toward higher functionality within smaller footprints, design density is increasing quickly. Fine-pitch components, multilayer architectures, and elevated power densities are now standard across industries ranging from automotive to medical and aerospace. While these advancements result in significant performance gains, they also introduce a less visible, but highly consequential, risk: contamination.
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