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Scienscope Introduces Reel Smart Incoming Material Stations
March 1, 2021 | Scienscope InternationalEstimated reading time: 1 minute
Scienscope International, a leading American supplier of cabinet style micro-focus X-ray systems, introduces the Reel Smart™ Incoming Material Stations (IMS): The Reel Smart Lite (IMS-100) and Reel Smart Pro (IMS-200).
The integration and management of components is critical when trying to achieve a “smart factory.” Scienscope IMS system provides integration from start to finish with accurate and complete data of all material processes and procedures. Many packed components are received with labels from manufacturers’ barcodes, a distributor's barcode, a forwarder's barcode, the customers’ barcode, etc. When received it can be difficult for the person scanning to pick the correct barcode to scan. Any incorrect reading can lead to an inventory and manufacturing process nightmare.
Incoming material system-100 (IMS-100): The high-resolution barcode camera system has an image-based algorithm that reads any barcode, even with defects. It reads and stores the information of four 7” reels simultaneously. As one reel is removed, a unique identification number label is printed, archiving reliable data that can be easily and conveniently traced.
The IMS-100 allows for EMS/ERP integration in seconds. It captures multi-codes quickly and without errors, allowing seamless integration of any material. Additionally, it helps automate the incoming goods process and boosts productivity dramatically.
Incoming material system-200 (IMS-200): This system is an updated system that includes an automatic loader and label placement that reduces the time and need for labor dramatically. It includes all the of amazing features of the IMS-100.
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Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.