Ynvisible, SpotSee Collaborate to Bring New Temperature Indication Solutions to Market
March 1, 2021 | Ynvisible Interactive Inc.Estimated reading time: 1 minute
Ynvisible Interactive Inc. announces its first customer collaboration to bring new temperature indication solutions to market with SpotSee, the global leader in shock, vibration and temperature monitoring through low-cost connectivity and data. Both companies are partners in the CHARISMA project, funded by the European Union, Horizon 2020 Marie Sk?odowska-Curie Actions program.
"The global demand for temperature tracking and indicators is increasing and has been further highlighted with the global impacts of COVID-19. SpotSee is a global leader at providing solutions to deter, detect and diagnose adverse conditions in supply chain and operations through our wide range of smart-label solutions. We're looking forward to expanding our solutions offering." says Tony Fonk, CEO SpotSee.?
Cold-chain and temperature-controlled shipment for monitoring the storage of goods such as blood bags, premium foods, biomaterials, and medicines use temperature indication smart-label solutions. Ynvisible's displays are integrated into those smart-labels and then applied on the surface of or inside logistics packaging, allowing users to observe signals with their naked eye.
"Our collaboration will help us realize real synergies between SpotSee's expertise and leadership in the cold-chain and monitoring supply chain and Ynvisible's ultra-low power, thin and flexible display technology." Says Michael Robinson, CEO Ynvisible Interactive. "Through our Roll-to-Roll manufacturing capability, technology know-how, and networks, we make it easy for our customers to unlock revenue-enhancing opportunities.?
The CHARISMA project is co-ordinated by the Institute of Organic Chemistry, Vienna University (Austria), includes Universidade Nova de Lisboa (Portugal), Tampere University (Finland), plus other partner companies, Science Made Simple, Packdesign ID Oy, and Trelic Oy.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Element Solutions Declares Q3 Dividend of $0.08 Per Share
08/22/2025 | BUSINESS WIREElement Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.
MacDermid Alpha Electronics Solutions Announces New Strategy Vice President Role for India
08/14/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is pleased to announce the appointment of Dr. Ravi Bhatkal to the newly created role of Vice President, Strategy, India.
Changes in Management Positions at Würth Elektronik eiSos Group
08/14/2025 | Wurth Elektronik eiSosWürth Elektronik, a leading manufacturer of electronic and electromechanical components for the electronics industry, announces two new appointments at the management level: Dirk Knorr has taken over the position of COO of the Würth Elektronik eiSos Group, and Sebastian Valet has taken over his previous position as Managing Director of Würth Elektronik eiSos GmbH & Co. KG.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/14/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.