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Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization

07/16/2024 | Michael Carano -- Column: Trouble in Your Tank
Laminate materials are the building blocks on which printed circuit boards are manufactured. Circuit board designers rely on the critical electrical properties of the materials to design the interconnects, and with the drive toward IoT (internet of things), autonomous driving, and virtual and augmented reality, material properties take on a very high level of importance.

Halo Industries Closes $80 Million Series B Funding Round Led by Thomas Tull’s U.S. Innovative Technology Fund

07/16/2024 | BUSINESS WIRE
Halo Industries, Inc., the creator of a laser manufacturing technology platform for the semiconductor industry, announced it raised up to $80 million in its oversubscribed Series B funding round. Led by Thomas Tull’s U.S. Innovative Technology Fund (USIT) with participation from 8VC and SAIC, the funding will help Halo Industries scale the commercialization and reach of its technology and advance its mission to establish the new gold-standard of silicon carbide substrate production.

iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging

07/16/2024 | iNEMI
Testing issues are limiting chip makers’ ability to create larger SOCs (system-on-chip). The scan field dimensions of EUV (extreme ultraviolet light) and NA (numerical aperture) EUV, which are typically used for testing, are too small. To enable larger chips, manufacturers are migrating to system-on-a-package (SOP).

Don’t Overconstrain Your Board Materials

07/02/2024 | I-Connect007 Editorial Team
When we started planning May’s issue, which centers on the use of traditional laminates in certain high-frequency PCBs, we knew we had to interview Kris Moyer and Ed Kelley together. Kris teaches advanced PCB design classes for IPC, and Ed is the former CTO of Isola and founder of Four Peaks Innovation. What ensued was a wide-ranging discussion on the evolution of “standard” PCB laminates and the recent trend by some OEMs to use these materials in high-frequency and even RF boards.

SEMI Applauds U.S. Chips Act Award For Entegris Semiconductor Materials Facility in Colorado

07/01/2024 | SEMI
SEMI, applauded the United States Department of Commerce's announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support Entegris construction of a state-of-the-art manufacturing center for advanced materials and process solutions for leading-edge semiconductors in Colorado Springs, Colorado.
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