-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Rogers Releases Inaugural Environmental, Social and Governance Report
March 2, 2021 | Rogers CorporationEstimated reading time: 2 minutes
Rogers Corporation has announced the release of its 2021 ESG Report, which details the Company’s environmental, social and governance (ESG) strategies and commitments.
“I am pleased to introduce Rogers’ first ESG Report,” stated Bruce D. Hoechner, Rogers' President and CEO. “This Report highlights the many actions Rogers takes to ensure we are a responsible corporate citizen for our employees, customers, shareholders, suppliers and the communities in which we operate. At Rogers we believe in ‘Results, but Results in the Right Way.’”
Hoechner continued, “Ever since our founder’s son, Henry Rogers, developed a process to remove dye from paper – enabling the paper to be recycled – sustainability has been rooted at the core of Rogers. Today, we supply our advanced materials for leading-edge technologies including electric and hybrid electric vehicles that reduce CO2 emissions; advanced driver assistance systems that improve automotive safety and enable autonomous vehicles; renewable energy applications that deliver clean energy solutions; and medical applications that protect the health of our frontline workers. We are dedicated to reducing our environmental impact as we strive to enable a cleaner, safer and more connected world.”
The Report follows established sustainability and reporting frameworks, including those published by the Global Reporting Initiative (GRI), Sustainability Accounting Standards Board (SASB) and Task Force on Climate- Related Financial Disclosures (TCFD). The Report includes details regarding the Company’s carbon footprint, approach to Diversity and Inclusion, and COVID-19 response, which prioritized the health and safety of Rogers’ employees, as it continued to supply customers with products.
The Report is available at the Company’s website.
About Rogers Corporation
Rogers Corporation is a global leader in engineered materials to power, protect and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable the company’s growth drivers -- advanced connectivity and advanced mobility applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, e-Mobility and renewable energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
AI Demand Drives PCB Material Market Growth
05/08/2026 | TPCAAs AI computing continues to drive a comprehensive upgrade in hardware specifications, the global printed circuit board industry is undergoing a profound structural transformation.