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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IDEX Biometrics Further Strengthens its Supply Chain by Partnering with MFLEX
March 3, 2021 | Globe NewswireEstimated reading time: 1 minute
IDEX Biometrics ASA, a leading provider of advanced fingerprint identification and authentication solutions, has signed an agreement with Multi-Fineline Electronix, Inc. (MFLEX), a subsidiary of Suzhou Dongshan Precision Manufacturing Co., Ltd. (DSBJ), and a leading global provider of high-quality, technologically advanced flexible printed circuits and assemblies. The agreement forms a key part of IDEX’s mass production ready supply chain, essential to meet the growing demand for biometric payment cards.
Under the agreement, MFLEX will provide flexible printed circuit assemblies for IDEX’s biometric payment card reference design. This reference design is the only biometric smart card reference design that has been used in cards certified by China UnionPay. MFLEX has received an initial order from a Tier 1 card manufacturer.
“Developing an end-to-end supply chain for biometric card manufacture is critical to accelerating the development of biometric cards by card producers,” said Reza Meshgin, CEO, MFLEX. “This allows card manufacturers to focus on their competences such as lamination, embedding, and personalization, and streamlines the card development and go-to-market processes.”
“As we establish a supply chain that is mass-production ready, we are pleased to have signed this agreement with MFLEX, a global leader in its field. This agreement allows card manufacturers to have instant access to high-quality flexible printed circuit boards in the required large quantities,” said Vince Graziani, CEO, IDEX Biometrics.
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Sweeney Ng - CEE PCBSuggested Items
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Siemens Expands EDA Software Access Through EuroCDP Project
05/14/2026 | SiemensSiemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
New Courses: Advance Your Electronics Expertise in June and July
05/14/2026 | Global Electronics AssociationStay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.