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DOD, Draper to Support of Computer Chips Advanced Packaging Solutions
March 3, 2021 | U.S. DoDEstimated reading time: Less than a minute
The Department of Defense (DOD) entered into a $14 million agreement with Draper to enhance the U.S.’s ability for volume production of advanced packaging solutions for computer chips embedded within defense systems.
Draper received a $10 million contract from the Defense Production Act (DPA) Title III office. The company also received a $4 million contract from the DOD Industrial Base Analysis and Sustainment (IBAS) office. Draper intends to expand existing domestic supplier production capabilities to produce three dimensional (3D), ultra-high-density microelectronics modules for use in mission critical applications. Draper’s integrated ultra-high-density technology is in high-volume production at i3 Microsystems’ fabrication facility in St. Petersburg, Fla.
Access to secure state-of-the-art microelectronics used by military systems like DoD aircraft, ground vehicles and complex weapons systems is critical to ensuring our nation’s technological advantage.
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