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SHENMAO Introduces Thermal Fatigue Resistant Solder Alloy
March 3, 2021 | SHENMAO America, Inc.Estimated reading time: Less than a minute
SHENMAO America, Inc. has introduced its PF719-P250 thermal fatigue resistant solder alloy for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.
PF719-P250 solder paste meets the requirements for the technologically advanced automotive electronics industry, offering improved reliability and durability necessary for PCB design for automotive applications. This solder paste from SHENMAO features zero halogen and improved insulation reliability, when compared to similar products.
SHENMAO’s PF719-P250 solder paste for automobile electronics meets the industry’s highest standards, providing consistent, reliable performance. This solder paste features excellent voiding performance and solderability.
SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.
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Nolan’s Notes: A Tribute to Iola—and Automation
12/02/2025 | Nolan Johnson -- Column: Nolan's NotesIn the 1960s and ’70s, when the west side of the Portland, Oregon, metro area was dominated by Tektronix, my grandmother worked as one of the “assembly ladies.” Known as “Tek,” the company was an economic juggernaut, driving the economy of the cities of Beaverton, Tigard, and Hillsboro. The only employer larger than Tektronix was the state of Oregon itself; virtually every Portlander had some connection to Tek.
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
11/26/2025 | Nash Bell -- Column: Knocking Down the Bone PileSolderability testing answers a simple question: How readily will a termination form a sound solder joint under defined conditions? It is not component preconditioning. Rather, it evaluates wetting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual “dip-and-look” or wetting-balance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use.
Indium Experts to Present on Power Electronics at productronica 2025
11/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics during Productronica, November 18-21, in Munich, Germany.