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Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 5, 2021 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
A perennial and yet irregular category on the popular game show Jeopardy is “potpourri.” My dad, as I was growing up, pronounced the word as “pot-poury.” It wasn’t until I was a sophomore in college that my girlfriend’s mom—who had a penchant for a soupcon of French euphemism in her tête-à-têtes—pronounced the word properly: “po-pu-ree.” Such are the risks of growing up just a bit rural.
On Jeopardy, the category is defined as “a mixing of unrelated, leftover questions from previous shows, so we’re lumping them under ‘Potpourri.’”
Now far be it for me to characterize this week’s top five as unrelated or leftover. Nor are they recycled from earlier weeks. This week’s topics are, however, heavier on mixture: a little bit from all over. There’s an industry sales report, Pete Starkey conference report, a look both backward and forward with Taiyo’s John Fix, an Altium/Amazon AWS working relationship in the news, and a brand-new I-007ebook on SMT Inspection from Koh Young’s Brent Fischthal.
Yep. A healthy mix of variety this week, doing “Potpourri” proud.
North American PCB Industry Sales Begin 2021 Up 4%
Published February 26
The IPC book-to-bill ratio weighs in at 1.14 for January, up 17.6% over January 2020. Hold this news up to the European Semiconductor Industry Association report that global semiconductor sales in 2020 logged a 6.5% increase from 2019, and it looks like the wave of increased demand is moving down the pipeline toward the assembly facilities.
2020: A Year of Learning, Innovation for Taiyo America
Published March 1
Pete Starkey has a virtual visit with John Fix, director of Sales and Marketing at Taiyo America, where they discuss the changes taking place because of COVID-19 restrictions, and some new products—including a new dry film solder mask for flexible circuits. Starkey and Fix’s discussion of how this new product works makes for interesting reading.
EIPC Technical Snapshot: Cleanliness
Published March 1
Cleanliness was the focus of this informative and enlightening event on Feb. 17, 2021, introduced by EIPC technical director Tarja Rapala-Virtanen and moderated by EIPC board member Christian Behrendt, CEO of German PCB fabricator ILFA. Pete Starkey brings his trademark summary of proceedings, including presentations from Freddy Gilbert, Professor Rajan Ambat, Emma Hudson, and Christian Behrendt.
Altium, AWS Collaborate to Advance Electronic Design
Published February 26
Cloud-based data sharing continues to move to the mainstream in all areas of modern life, and the engineering disciplines are no exception. For example, the Altium 365 cloud-based platform and Altium Designer is working to create “the most connected design experience” in the industry, streamlining the product development process through thoughtful sharing of centrally-stored design data. To achieve this goal, Altium selected Amazon Web Services (AWS) to host Altium 365, the cloud platform for collaborative PCB design and realization.
New I-007eBook Highlights SMT Inspection: Today, Tomorrow, and Beyond
Published March 3
If you have an interest (and who doesn’t?) in PCB board inspection, you know that even engineers and layout specialists are involved in making inspection succeed by the decisions made during the design phase). This new I-0007eBook from Koh Young is a must read. In The Printed Circuit Assembler’s Guide to SMT Inspection: Today, Tomorrow, and Beyond, author Brent Fischthal takes readers through a brief history of SMT inspection before discussing the benefits of data-driven analytics and how intelligent software solutions can help companies analyze and optimize the production process.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.