-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Releases Free Smart Factory for Electronics Manufacturing Presentation
March 9, 2021 | Happy Holden, I-Connect007Estimated reading time: 2 minutes
The IPC APEX EXPO 2021 Technical Program features a tract on the “Factory of the Future Implementation,” March 10-11. As part of that program, IPC has made available a free presentation and video from the Manufacturing Technology Center (MTC), a CFX Program member. The presentation is titled “MTC's Implementation of CFX with Legacy Equipment.”
In this presentation, Barry Maybank along with Naim Kapadia, MTC technology manager, explains the background of the MTC, one of seven high-value-manufacturing technology catapult centers established in the UK. The other six are:
- Advanced Forming Research Centre (AFRC)
- Centre for Process Innovation (CPI)
- Nuclear Advanced Manufacturing Research Centre (NAMRC)
- Advanced Manufacturing Research Centre (AMRC)
- Warwick Manufacturing Group (WMG)
- The National Composites Centre (NCC)
MTC’s role is to provide support, consulting, implementation examples, and leadership in the effort to introduce and implement the smart factory into UK industries, in this case, electronics assembly (Figure 1).
Figure 1: The digital-value alignment and drivers for electronics manufacturing. (Source: All images courtesy of IPC & MTC)
Barry discusses MTC’s vision and journey enabling smart factory for electronics manufacturing for a low-volume, high-mix environment using legacy equipment by implementing IPC-CFX. Barry and Naim share why MTC chose this path and what they see as the future for IPC-CFX as part of their goals and vision for their smart factory initiatives.
Figure 2: MTC’s Smart Factory a) SMT equipment; b) SMT line Smart Factory architecture.
Figure 2 shows the SMT line at MTC and the current networking. Three networks are involved in running their SMT line, and each machine has its own industrial PC or PLC on that respective network, shown as “grey,” “blue,” and “yellow” (Figure 2b). MTC wanted to bring the two legacy machines, the solder paste printer and the reflow oven, into the modern CFX network of the solder paste inspection, pick-and-place machine, and the automatic optical inspection unit.
They started by adding an industrial PC (a Beckman PC w/Windows 10) to each of the legacy machines embedded controller. Then these PCs were connected to the Rabbit MQ server that also communicated with the CFX compatible machine controller (Figure 3a).
Figure 3: a) Hardware setup for implementing IPC CFX, and b) software setup from the SDK for IPC CFX.
Figure 3b shows the software setup. Using the SDK software from IPC, a script was written in C for each PC, called the EXTRACTOR. Its job was to take standard log files from each machine and move it to the CFX program ADAPTOR in the server. Typical data from the solder paste printer is shown in Figure 4a. This data now provides traceability and trends, as well as alarms to the CFX Network. By adding a shareware visualization program called Thinkboard, it was possible to create Real-Time Dashboard (Figure 4b).
Figure 4: a) Solder paste printer sensors and b) implemented software setup for traceability and trends.
MTC then presented a five-minute video of their plans for PHASE 2 Smart Factory: cyber security for OT, augmented reality for machine maintenance and co-bot robotics to carry out multi-tasking in the assembly process.
Other highlights of this presentation include:
- The Role for Automation and Robotics in Electronics Manufacturing,
presented by: Mike Wilson, MTC - Working with the Augmented Reality/Mix Reality in Electronics Manufacturing,
presented by David Varela, MTC - Advanced, Non-real Time Uses of Machine Data for Factory Operational Improvement
- Industry 4.0 Predictive Feeder Maintenance Case Study in 10+ Factories
- Flex Implementing a Global Machine Data Collection System
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.