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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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Real Time with...IPC APEX EXPO 2021: Optimizing Pin Inspection In Automotive With True3D Tech
March 9, 2021 | Real Time with...IPCEstimated reading time: Less than a minute
Guest Editor Michael Ford and Gustavo Jimenez, Koh Young's sales manager for Northern Mexico, discuss some of the company's newest technologies, including True3D™ technology for pin inspection, which has proven to help improve processes and has become quite popular with the automotive segment.
To view this Real Time with... IPC APEX EXPO 2021 interview, click here.
Don't miss our latest title from I-007eBooks and Koh Young America, The Printed Circuit Assembler’s Guide to SMT Inspection: Today, Tomorrow, and Beyond. In this book, readers will learn how artificial intelligence has demonstrated promising potential in this field and has far-reaching applications within the manufacturing sector.
According to Michael Ford, Senior Director of Emerging Industry Strategy for Aegis Software, “This book provides unprecedented visibility of SMT processes, asserting inspection technology as a key active contributor to zero-defect quality initiatives, rather than being limited to simple defect detection.”
Download your free copy today!
Suggested Items
Marcy’s Musings: The ‘Magic’ of Additive Processes
05/21/2024 | Marcy LaRont -- Column: Marcy's MusingsThough modern semi-additive and fully additive technologies are still emerging for PCB manufacturing, additive technology itself is not new. Many PCB fabricators find themselves at a crossroads when deciding whether to change their current processes and go additive or stay the course until something significant compels a change. But change is on the horizon, and it seems to be driven by significant technological advancements in chips and advanced packaging, offering PCB fabricators some additive manufacturing solutions to explore.
Textron Systems Collaborates with Kodiak to Develop Uncrewed Military Vehicle
05/20/2024 | PRNewswireTextron Systems Corporation, a Textron Inc. company, a leading developer of crewed and uncrewed military ground vehicles, and Kodiak Robotics, Inc., a leading self-driving technology developer for the trucking and defense markets, announced that they are collaborating to develop an autonomous military ground vehicle specifically designed for driverless operations.
Additive Manufacturing: PCB007 Magazine May 2024 Issue
05/20/2024 | I-Connect007 Editorial TeamThough modern semi-additive and fully additive technologies are still emerging for PCB manufacturing, additive technology itself is not new. In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
Terran Orbital’s GEOStare SV2 Captures 3 Years of Success in High-Resolution Imaging
05/17/2024 | BUSINESS WIRETerran Orbital Corporation, a global leader in satellite-based solutions primarily serving the aerospace and defense industries, celebrates the 3rd anniversary of its successful GEOStare SV2 mission. Launched on May 15, 2021, from NASA’s Kennedy Space Center in Florida, GEOStare SV2 has surpassed expectations, delivering exceptional results for commercial satellite imagery.
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.