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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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Agfa Appoints all4-PCB as New Distributor of its PCB Solutions in Western USA, Canada
March 17, 2021 | AgfaEstimated reading time: Less than a minute
Agfa announces the appointment of all4-PCB as their new distributor to handle their PCB Solutions product range in the Western USA and Canada regions. The agreement includes the distribution of Agfa’s IdeaLINE phototooling films and DiPaMAT inkjet inks used in the production of printed circuit boards and metal structuring applications.
Frank Louwet, Business Unit Manager Electronic Print at Agfa, comments: “all4-PCB are a natural strategic partner for Agfa’s PCB solutions and have a wealth of expertise, knowledge and success in the PCB supply market. all4-PCB possess an especially strong background for introducing our new digital technology into the market. We are delighted to start working together”.
Torsten Reckert, President all4-PCB adds: “We are very pleased to be handling Agfa’s DiPaMAT range of inkjet solder mask, legend inks, and etch resist as well as the IdeaLINE phototooling film products. They complement very well our experience in the imaging areas of our PCB & Chemical Milling customer base. Being part of the technology transition from the traditional imaging processes using phototools and moving onwards toward inkjet solutions is very exciting. We look forward to a strong relationship with Agfa.”
Suggested Items
Winners of IPC Hand Soldering and Rework Competition Vietnam 2024 Announced
09/19/2024 | IPCIn conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13. Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors.
Understanding Cleaning Challenges for Automated Solder Paste Dispensing
09/18/2024 | Debbie Carboni, KYZENIn today’s rapidly evolving electronics manufacturing landscape, staying abreast of innovative technologies is crucial. As solder paste and substrate materials continually evolve and become more complex, optimizing production methods with the latest technology ensures performance and quality while reducing operational costs.
Successful Rehm Technology Days 2024 – Where the Future Meets Technology
09/17/2024 | Rehm Thermal SystemsTraditionally, the Rehm Technology Days offer a valuable opportunity for knowledge exchange, networking and discussion. Once again this year, numerous customers, partner companies, press representatives and employees from the worldwide locations met at the company headquarters in Blaubeuren-Seissen.
Circuit Technology Center Announces Expanded Tinning Services Capacity
09/16/2024 | Circuit Technology CenterCircuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning.
The Knowledge Base: The Pivotal Role of Solder Paste
09/16/2024 | Mike Konrad -- Column: The Knowledge BaseIn the complex world of electronics manufacturing, the humble solder paste plays a pivotal role. Often overshadowed by more conspicuous electronics assembly equipment and materials, this blend of powdered metal and flux is the unsung hero that binds the electronic circuits together. But beyond its adhesive and conductive properties, the selection of the right solder paste is crucial for ensuring the long-term reliability of electronic devices.