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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Elmatica Expands IT Department
March 18, 2021 | ElmaticaEstimated reading time: 2 minutes
Digitalization of the supply chain is a vital project for Elmatica and raises the bar for having the best IT developers.
Elmatica recently increased their IT Department with Junior Developer April Yeats, and is currently searching for another Senior Developer to join the team.
The Needle in the Haystack and the Eager Newcomers
“Meeting April, was an immediate mutual match. We are so happy to have her onboard. Adding juniors to the team is a win-win, they are committed, self driven and eager to learn. Cybersecurity and software development is on everyone's lips these days, thus, the search for experienced candidates within these fields can be as searching for the famous needle in the haystack.”, says IT Manager Robert Kurti.
The demand for experienced juniors within programming has increased in recent years. For Yeats, it was the first meeting with Elmatica that decided where she wanted to put her efforts.
“The day I turned up for my first interview at Elmatica, I was treated not as a number, but as a person. It became apparent very quickly just from the atmosphere that this was a welcoming community. As I was looking for my very first job in programming, I knew I had a lot to learn, and therefore valued a place that above all else would give me the support to further grow my skills and I felt that Elmatica could give me that”, says April Yeats.
Starting a New Job During a Pandemic
Even if the COVID-situation has affected how often she can meet her new colleagues and get to know the company and the people, the team feeling has never been missing, nor the challenges.
“From the get go, I was made to feel like a part of the team, even though we weren't all able to work in the office together. My immediate team has been extra accommodating to me, and although the first two weeks were a little intimidating, I was met with patience and understanding. I'm excited to continue learning, and to get to know everyone a little better, and embrace all the challenges thrown towards me, and they come daily”, Yeats finishes with a smile.
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Brent Fischthal - Koh YoungSuggested Items
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
New Courses: Advance Your Electronics Expertise in June and July
05/14/2026 | Global Electronics AssociationStay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.
Protecting Advanced Trucking Electronics in Harsh Environments
05/13/2026 | Beth Massey, MacDermid Alpha Electronics SolutionsFor decades, trucking was defined by horsepower, payload, and driver endurance. Today, the competitive edge lies in electronics, as advanced sensing, communications, and data processing systems reshape how commercial vehicles operate. The industry is rapidly digitizing, with electronic systems now critical to safety, uptime, and fleet efficiency. Technologies like ADAS, radar, lidar, and telematics enable real-time decision-making, while distributed sensors monitor key vehicle functions. Because these systems operate in harsh conditions, environmental protection using potting, coatings, and encapsulation is now a core design priority.
Designing Without a Rulebook: When Engineering Becomes Innovation
05/05/2026 | Stephen V. Chavez, Siemens EDAWhat if the very rules that made you successful as a PCB designer are the ones now holding you back? This reminds me of walking the floor and attending sessions at both PCB West 2025 and APEX EXPO 2026, where one common theme stood out: More designs with traditional PCB “best practices” simply don’t apply. It’s not because they’re wrong, but because the problems we’re solving have fundamentally changed. In some cases, those best practices can actually limit performance. This is where PCB design moves beyond optimization and into something far more challenging: designing without a rulebook.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.