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Circuit Technology Center Expands Component Modification Services Capabilities
March 22, 2021 | Circuit Technology CenterEstimated reading time: Less than a minute
Circuit Technology Center announces that it has recently installed and commissioned a second robotic hot solder dip (RHSD) machine, expanding its component modification and alteration service department. Applications for RHSD services include tin mitigation, gold mitigation, lead reconditioning and BGA component re-balling services for mission critical electronic components.
“For over 35 years, leading defense and aerospace companies have relied on Circuit Technology Center as the world leader in circuit board level modification and damage repair services,” said Andy Price, Sales Manager at Circuit Technology Center. “We are thrilled to announce this expansion, offering our high reliability customer base component modification and alteration services with the same level of unexcelled quality and service that they’ve come to expect from our company.”
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