Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
KYZEN to Present at SMTA China East Conference
March 29, 2021 | KYZEN'Estimated reading time: 2 minutes
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is pleased to announce that Daniel Gao, Sales Manager – Northern and Western China, will present during the SMTA China East Conference on April 22, 2021. Gao will present “The Relationship Between Cleanliness and Reliability/Durability.”
Cleaning, or lack thereof, can have a serious impact on the long-term durability and reliability of some finished products. Using a single number conductive measurement limit as a control basis for key precision or critical cleaning processes can be tremendously risky and expensive. IPC removed from the J-STD-001 Rev. H, the ROSE limit of 1.56 µg/cm² as a statement of “Clean” due to modern flux, component, and board designs. One size no longer fits all with today’s technology.
This is the reason the IPC J-STD-001 no longer sets a limit for the ROSE, and in fact, WP-019B states “passing the ROSE test using the 1.56 µg/cm² value, does not guarantee that an assembly is clean, good or acceptable.” Likewise, the PM-019B also states there are no pass-fail levels for Cation or Anion levels in Ion Chromatography. The question, answer, and responsibility falls on the manufacturer and/or OEM to determine the acceptable ROSE limit that will meet their cleanliness needs for reliability, based on objective evidence.
In this paper, Gao will explore how a PCB can achieve a ROSE value under the previous 1.56µg/cm² recommended limit, as well as industry acceptable limits of ion chromatography, yet still not meet the reliability and durability requirements of field operation.
He will further explore why some products can pass with a higher number and/or a different cleanliness measurement, how you can avoid mistakes in a very competitive market and reduce your cost while improving your brand reputation.
Based in BeiJing, Gao has more than 15 years of experience in semiconductor applications and electronic assemblies including wafer bumping processes, flip chip packaging, LED packaging and PCB assembly applications. Gao has worked for KYZEN for more than ten years, responsible for sales, marketing and customer technical support, cooperating with solder paste and cleaning machine suppliers in Northern and Western China.
About KYZEN
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.