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SigmaTron’s Acun?a, Mexico Facility Expanding SMT
March 29, 2021 | SigmaTron International Inc.Estimated reading time: 1 minute
SigmaTron International’s facility in Acun?a, Mexico added an SMT line last year and has placed an order for an additional line scheduled to arrive this summer.
“Our business grew significantly once Mexico eased its COVID-19 restrictions last April. That drove the decision to add an SMT line last year. We’ve placed a second line on order because we continue to see very strong demand for capacity,” said Dan Camp, VP Acun?a/Del Rio Operations.
Each line features a DEK Neohorizon 03iX printer, a dual head ASM Siplace SX2 chip shooter, an ASM SX2 odd-form part placer and a BTU Pyramax 100N nitro- gen reflow solder system along with shut- tle conveyors for automated board handling.
“We’ve configured these SMT lines for high volume assembly with minimal product han- dling during that process. The equipment is easy to reconfigure for changing product mix and upgradeable should our customers’ needs evolve,” said Ricardo Guerra, the facility’s SM/A-I Manager.
The DEK printer includes precision optics, semi- automatic stencil load and an understencil cleaning system with a core cycle time of 8 seconds. The Siplace chip shooter can place components as small as 0201 and all of the SX machines have modular configurability via their SX gantries. The BTU Pyramax nitrogen reflow oven has 8 top and 8 bottom zones for precision-controlled heating.
“The new lines are a welcome addition given our current production schedule. Our growth is a testament to the hard work of our team. They’ve managed to maintain high customer satisfaction in a very challenging environment,” added Dan.
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Sweeney Ng - CEE PCBSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.